Pwonse H-1B nan Boise, ID
Anplwayè yo te depoze 2,069 aplikasyon kondisyon travay pou travay nan Boise, ID pandan ane fiskal 2023–2026. Salè baz medyàn ofri: $110,878.
Demann (LCA)2,069
Salè medyan ofri$110,878
Mwatye salè yo$92,988–$130,208
10yèm–90yèm pousantaj$75,653–$155,170
Avoka imigrasyon, rekritè oswa anplwayè? Mete sèvis ou an tèt paj sa a — $99 pou 30 jou →
Pi gwo pwonse yo
Oksipasyon
Tit travay
- Semiconductor Process Engineer71
- Software Engineer37
- Semiconductor Design Engineer28
- Software Developer27
- Supply Chain Engineer25
- Product Development Engineer21
- Equipment Engineer18
- Technical Lead L115
- Process Support Engineer15
- Package Solution Consultant15
- Software Development Engineer13
- Semiconductor Product Engineer13
- Infrastructure Specialist13
- Data Scientist12
- Senior Semiconductor Process Engineer12
- Medical Technologist10
- Process Development Engineer10
- Customer Engagement Applications Engineer10
- Project Manager8
- IT Solution Architect - PLM8
- IT Software Engineer8
- Product Manager8
- SAP Functional Analyst8
- Manufacturing Engineer8
- Machine Learning Engineer7
- DRAM Design Engineer7
- Software Engineer III7
- Senior Supply Chain Planner7
- Field Process Engineer6
- Solution Architect L16
Salè yo se fen ki pi ba nan salè yo ofri sou chak aplikasyon, konvèti nan yon montan anyèl; estatistik yo itilize sèlman aplikasyon tan plen sètifye. Yon LCA pa yon apwobasyon visa epi yon sèl LCA ka kouvri plizyè pozisyon. Sous: Depatman Travay Etazini, Done Divulgasyon LCA OFLC, ane fiskal 2023–2026 (dènye desizyon Jun 30, 2026).