Done sou Salè H1B

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Packaging R&D Engineer nan Intel Corporation: Salè H-1B

5 aplikasyon kondisyon travay pou tit travay Packaging R&D Engineer nan Intel Corporation. Salè baz medyàn ofri $179,650; mwatye mitan $177,200–$181,314.

Demann (LCA)5
Salè medyan ofri$179,650
Mwatye salè yo$177,200–$181,314
10yèm–90yèm pousantaj$167,550–$187,729

Pa ane fiskal

Ane fiskalLCASalè medyan
FY20231$161,117
FY20241$179,650
FY20253$181,314

Aplikasyon

Salè bazKoteSoumètDat kòmansmanEstati
$192,005–$241,880
Nivo III
Austin, TXJul 31, 2025Oct 1, 2025Certifye
$181,314–$250,160
Nivo III
Round Rock, TXJun 3, 2025Oct 1, 2025Certifye
$177,200–$250,160
Nivo III
Chandler, AZApr 23, 2025Oct 1, 2025Certifye
$179,650–$221,610
Nivo IV
Chandler, AZMar 14, 2024Aug 28, 2024Certifye
$161,117–$221,610
Nivo III
Chandler, AZMar 16, 2023Sep 8, 2023Certifye

Lòt travay nan Intel Corporation

Salè yo se fen ki pi ba nan salè yo ofri sou chak aplikasyon, konvèti nan yon montan anyèl; estatistik yo itilize sèlman aplikasyon tan plen sètifye. Yon LCA pa yon apwobasyon visa epi yon sèl LCA ka kouvri plizyè pozisyon. Sous: Depatman Travay Etazini, Done Divulgasyon LCA OFLC, ane fiskal 2023–2026 (dènye desizyon Jun 30, 2026).