Done sou Salè H1B

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Semiconductor Packaging Engineer nan NXP USA, Inc.: Salè H-1B

8 aplikasyon kondisyon travay pou tit travay Semiconductor Packaging Engineer nan NXP USA, Inc.. Salè baz medyàn ofri $137,700; mwatye mitan $125,000–$147,897.

Demann (LCA)8
Salè medyan ofri$137,700
Mwatye salè yo$125,000–$147,897
10yèm–90yèm pousantaj$100,040–$152,367

Pa ane fiskal

Ane fiskalLCASalè medyan
FY20234$120,000
FY20253$151,012
FY20261$145,400

Aplikasyon

Salè bazKoteSoumètDat kòmansmanEstati
$145,400
Nivo II
Austin, TXApr 15, 2026Oct 1, 2026Certifye
$146,859
Nivo IV
Austin, TXMay 21, 2025Oct 1, 2025Certifye
$155,530
Nivo II
Austin, TXMay 2, 2025Oct 1, 2025Certifye
$151,012
Nivo III
Austin, TXNov 15, 2024Dec 2, 2024Certifye
$110,000
Nivo II
Austin, TXAug 4, 2023Oct 1, 2023Certifye
$76,800
Nivo I
Austin, TXMay 17, 2023Oct 1, 2023Certifye
$130,000
Nivo II
Austin, TXApr 17, 2023Oct 1, 2023Certifye
$130,000
Nivo II
Chandler, AZApr 12, 2023Aug 6, 2023Certifye

Lòt travay nan NXP USA, Inc.

Salè yo se fen ki pi ba nan salè yo ofri sou chak aplikasyon, konvèti nan yon montan anyèl; estatistik yo itilize sèlman aplikasyon tan plen sètifye. Yon LCA pa yon apwobasyon visa epi yon sèl LCA ka kouvri plizyè pozisyon. Sous: Depatman Travay Etazini, Done Divulgasyon LCA OFLC, ane fiskal 2023–2026 (dènye desizyon Jun 30, 2026).