Done sou Salè H1B

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Compiler Toolchain Software Engineer nan Qualcomm Innovation Center, Inc.: Salè H-1B

7 aplikasyon kondisyon travay pou tit travay Compiler Toolchain Software Engineer nan Qualcomm Innovation Center, Inc.. Salè baz medyàn ofri $97,000; mwatye mitan $97,000–$105,877.

Demann (LCA)7
Salè medyan ofri$97,000
Mwatye salè yo$97,000–$105,877
10yèm–90yèm pousantaj$97,000–$114,754

Pa ane fiskal

Ane fiskalLCASalè medyan
FY20234$97,000
FY20241$97,000
FY20262$114,754

Aplikasyon

Salè bazKoteSoumètDat kòmansmanEstati
$114,754–$148,300
Nivo II		Austin, TXJan 19, 2026Jul 9, 2026Certifye
$114,754–$148,300
Nivo II		Austin, TXDec 8, 2025Jun 1, 2026Certifye
$97,000–$145,000
Nivo II		Austin, TXMar 13, 2024Jul 26, 2024Certifye
$97,000–$145,000
Nivo II		Austin, TXFeb 16, 2023Jun 23, 2023Certifye
$97,000–$145,000
Nivo II		Austin, TXJan 26, 2023Jul 28, 2023Certifye
$97,000–$145,000
Nivo II		Austin, TXJan 18, 2023Jun 23, 2023Certifye
$97,000–$145,000
Nivo II		Austin, TXNov 18, 2022May 18, 2023Certifye

Lòt travay nan Qualcomm Innovation Center, Inc.

Salè yo se fen ki pi ba nan salè yo ofri sou chak aplikasyon, konvèti nan yon montan anyèl; estatistik yo itilize sèlman aplikasyon tan plen sètifye. Yon LCA pa yon apwobasyon visa epi yon sèl LCA ka kouvri plizyè pozisyon. Sous: Depatman Travay Etazini, Done Divulgasyon LCA OFLC, ane fiskal 2023–2026 (dènye desizyon Jun 30, 2026).