Akèy › Anplwayè › Qualcomm Technologies, Inc. › Senior Packaging Engineer
Senior Packaging Engineer nan Qualcomm Technologies, Inc.: Salè H-1B
16 aplikasyon kondisyon travay pou tit travay Senior Packaging Engineer nan Qualcomm Technologies, Inc.. Salè baz medyàn ofri $123,317; mwatye mitan $115,500–$128,898.
Demann (LCA)16
Salè medyan ofri$123,317
Mwatye salè yo$115,500–$128,898
10yèm–90yèm pousantaj$115,500–$128,898
Pa ane fiskal
| Ane fiskal | LCA | Salè medyan |
|---|---|---|
| FY2023 | 3 | $115,500 |
| FY2024 | 4 | $115,500 |
| FY2025 | 4 | $127,200 |
| FY2026 | 5 | $128,898 |
Aplikasyon
| Salè baz | Kote | Soumèt | Dat kòmansman | Estati |
|---|---|---|---|---|
| $127,200–$190,800 Nivo II | Irvine, CA | Apr 27, 2026 | Apr 29, 2026 | Certifye |
| $128,898–$190,800 Nivo II | San Diego, CA | Mar 16, 2026 | Aug 25, 2026 | Certifye |
| $128,898–$190,800 Nivo II | San Diego, CA | Jan 12, 2026 | Jun 25, 2026 | Certifye |
| $128,898–$190,800 Nivo II | San Diego, CA | Dec 11, 2025 | May 1, 2026 | Certifye |
| $128,898–$190,800 Nivo II | San Diego, CA | Nov 14, 2025 | Nov 15, 2025 | Certifye |
| $156,853–$209,200 Nivo II | Santa Clara, CA | Aug 13, 2025 | Aug 13, 2025 | Certifye |
| $127,200–$190,800 Nivo II | Austin, TX | Aug 13, 2025 | Jan 13, 2026 | Certifye |
| $127,200–$190,800 Nivo II | San Diego, CA | Mar 4, 2025 | Sep 2, 2025 | Certifye |
| $119,434–$173,500 Nivo II | San Diego, CA | Jan 16, 2025 | Jul 12, 2025 | Certifye |
| $115,500–$173,500 Nivo II | San Diego, CA | Mar 19, 2024 | Jul 7, 2024 | Certifye |
| $115,500–$173,500 Nivo II | San Diego, CA | Mar 12, 2024 | Jul 7, 2024 | Certifye |
| $115,500–$173,500 Nivo II | San Diego, CA | Nov 20, 2023 | May 10, 2024 | Certifye |
| $115,500–$173,500 Nivo II | San Diego, CA | Nov 1, 2023 | Nov 2, 2023 | Certifye |
| $115,500–$173,500 Nivo II | Arcadia, CA | Jan 24, 2023 | Jul 13, 2023 | Certifye |
| $115,500–$173,500 Nivo II | Austin, TX | Jan 23, 2023 | Jul 13, 2023 | Certifye |
| $115,500–$173,500 Nivo II | San Diego, CA | Jan 23, 2023 | Jul 13, 2023 | Certifye |
Senior Packaging Engineer nan tout anplwayè yo →
Lòt travay nan Qualcomm Technologies, Inc.
- Senior ASICS Engineer$112,882
- Senior Software Engineer$121,597
- ASICS Engineer$109,470
- Software Engineer$111,322
- Staff ASICS Engineer$136,282
- Senior Cellular System Test Engineer$121,597
- Senior CPU Engineer$133,000
- Cellular System Test Engineer$104,290
- Staff Software Engineer$146,328
- Senior Modem Technologies Engineer$119,500
- Senior GPU Engineer$133,600
- Staff CPU Engineer$152,506
- Senior Staff ASICS Engineer$159,702
- Senior Camera Engineer$119,434
- Senior Machine Learning Engineer$133,000
- Staff GPU Engineer$151,000
- Senior Staff CPU Engineer$179,000
- GPU Engineer$116,843
- Senior Hardware Engineer$112,882
- Staff Cellular System Test Engineer$146,328
- Staff Modem Technologies Software Engineer$146,328
- Senior Modem Technologies Software Engineer$121,597
- Camera Engineer$112,882
- Senior Cellular Technologies Engineer$114,500
Salè yo se fen ki pi ba nan salè yo ofri sou chak aplikasyon, konvèti nan yon montan anyèl; estatistik yo itilize sèlman aplikasyon tan plen sètifye. Yon LCA pa yon apwobasyon visa epi yon sèl LCA ka kouvri plizyè pozisyon. Sous: Depatman Travay Etazini, Done Divulgasyon LCA OFLC, ane fiskal 2023–2026 (dènye desizyon Jun 30, 2026).