Done sou Salè H1B

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Senior Staff Packaging Engineer nan Qualcomm Technologies, Inc.: Salè H-1B

12 aplikasyon kondisyon travay pou tit travay Senior Staff Packaging Engineer nan Qualcomm Technologies, Inc.. Salè baz medyàn ofri $169,000; mwatye mitan $169,000–$180,400.

Demann (LCA)12
Salè medyan ofri$169,000
Mwatye salè yo$169,000–$180,400
10yèm–90yèm pousantaj$169,000–$180,400

Pa ane fiskal

Ane fiskalLCASalè medyan
FY20234$169,000
FY20243$169,000
FY20255$180,400

Aplikasyon

Salè bazKoteSoumètDat kòmansmanEstati
$180,400–$270,600
Nivo IV		San Diego, CAMar 25, 2025Jun 1, 2025Certifye
$180,400–$270,600
Nivo IV		San Diego, CAMar 4, 2025Aug 24, 2025Certifye
$180,400–$270,600
Nivo IV		San Diego, CAFeb 17, 2025Aug 11, 2025Certifye
$162,400–$243,600
Nivo IV		Gilbert, AZFeb 4, 2025Jul 26, 2025Certifye
$169,000–$254,000
Nivo IV		San Diego, CANov 22, 2024May 22, 2025Certifye
$169,000–$254,000
Nivo IV		San Diego, CAMay 23, 2024Nov 19, 2024Certifye
$169,000–$254,000
Nivo IV		San Diego, CAFeb 24, 2024Aug 3, 2024Certifye
$188,926–$264,500
Nivo IV		Santa Clara, CASep 25, 2023Mar 22, 2024Certifye
$169,000–$254,000
Nivo IV		San Diego, CAApr 25, 2023Oct 1, 2023Certifye
$169,000–$254,000
Nivo IV		San Diego, CAFeb 20, 2023Jul 13, 2023Certifye
$169,000–$254,000
Nivo IV		San Diego, CAJan 28, 2023Jul 13, 2023Certifye
$169,000–$254,000
Nivo IV		San Diego, CAJan 18, 2023Jul 13, 2023Certifye

Lòt travay nan Qualcomm Technologies, Inc.

Salè yo se fen ki pi ba nan salè yo ofri sou chak aplikasyon, konvèti nan yon montan anyèl; estatistik yo itilize sèlman aplikasyon tan plen sètifye. Yon LCA pa yon apwobasyon visa epi yon sèl LCA ka kouvri plizyè pozisyon. Sous: Depatman Travay Etazini, Done Divulgasyon LCA OFLC, ane fiskal 2023–2026 (dènye desizyon Jun 30, 2026).