Beranda › Pemberi Kerja › Qualcomm Technologies, Inc. › Packaging Engineer
Gaji H-1B untuk Packaging Engineer di Qualcomm Technologies, Inc.
21 aplikasi kondisi tenaga kerja untuk jabatan Packaging Engineer di Qualcomm Technologies, Inc.. Gaji pokok median yang ditawarkan $112.882; setengah tengah $108.638–$127.462.
Lamaran (LCA)21
Median gaji yang ditawarkan$112.882
Setengah bagian tengah gaji$108.638–$127.462
Persentil ke-10 hingga ke-90$103.956–$144.000
Berdasarkan Tahun Fiskal
| Tahun Fiskal | LCA | Median Gaji |
|---|---|---|
| FY2023 | 7 | $108.638 |
| FY2024 | 5 | $112.882 |
| FY2025 | 5 | $119.434 |
| FY2026 | 3 | $128.898 |
Aplikasi
| Gaji Pokok | Lokasi | Diajukan | Tanggal Mulai | Status |
|---|---|---|---|---|
| $156.853–$177.400 Level II | Santa Clara, CA | 21 Jan 2026 | 25 Jun 2026 | Tersertifikasi |
| $110.656–$162.600 Level II | Austin, TX | 19 Jan 2026 | 23 Jun 2026 | Tersertifikasi |
| $128.898–$162.600 Level II | San Diego, CA | 19 Jan 2026 | 23 Jun 2026 | Tersertifikasi |
| $140.805–$177.400 | Santa Clara, CA | 11 Mar 2025 | 4 Sep 2025 | Tersertifikasi |
| $119.434–$162.600 Level II | San Diego, CA | 13 Feb 2025 | 5 Agu 2025 | Tersertifikasi |
| $98.500–$147.500 Level II | Austin, TX | 30 Jan 2025 | 22 Jul 2025 | Tersertifikasi |
| $119.434–$147.500 Level II | San Diego, CA | 30 Jan 2025 | 19 Jul 2025 | Tersertifikasi |
| $119.434–$147.500 Level II | San Diego, CA | 30 Jan 2025 | 26 Jul 2025 | Tersertifikasi |
| $109.470–$147.500 Level II | Austin, TX | 29 Mar 2024 | 10 Sep 2024 | Tersertifikasi |
| $126.984–$169.800 Level II | Santa Clara, CA | 10 Mar 2024 | 13 Agu 2024 | Tersertifikasi |
| $112.882–$147.500 Level II | San Diego, CA | 12 Feb 2024 | 6 Agu 2024 | Tersertifikasi |
| $112.882–$147.500 Level II | San Diego, CA | 10 Feb 2024 | 26 Jul 2024 | Tersertifikasi |
| $112.882–$147.500 Level II | San Diego, CA | 6 Feb 2024 | 19 Jul 2024 | Tersertifikasi |
| $144.000–$216.000 Level II | San Diego, CA | 9 Jun 2023 | 1 Okt 2023 | Tersertifikasi |
| $144.000–$216.000 Level II | San Diego, CA | 8 Jun 2023 | 1 Okt 2023 | Tersertifikasi |
| $104.562–$147.500 Level II | San Diego, CA | 14 Feb 2023 | 27 Jun 2023 | Tersertifikasi |
| $98.500–$147.500 Level II | Bryan, TX | 9 Feb 2023 | 27 Jun 2023 | Tersertifikasi |
| $104.562–$147.500 Level II | San Diego, CA | 13 Jan 2023 | 27 Jun 2023 | Tersertifikasi |
| $108.638–$147.500 Level II | Austin, TX | 4 Jan 2023 | 4 Jan 2023 | Tersertifikasi |
| $108.638–$147.500 Level II | Austin, TX | 2 Jan 2023 | 4 Jan 2023 | Tersertifikasi |
| $108.638–$147.500 Level II | Austin, TX | 30 Des 2022 | 4 Jan 2023 | Ditarik |
Packaging Engineer di semua pemberi kerja →
Jabatan lain di Qualcomm Technologies, Inc.
- Senior ASICS Engineer$112.882
- Senior Software Engineer$121.597
- ASICS Engineer$109.470
- Software Engineer$111.322
- Staff ASICS Engineer$136.282
- Senior Cellular System Test Engineer$121.597
- Senior CPU Engineer$133.000
- Cellular System Test Engineer$104.290
- Staff Software Engineer$146.328
- Senior Modem Technologies Engineer$119.500
- Senior GPU Engineer$133.600
- Staff CPU Engineer$152.506
- Senior Staff ASICS Engineer$159.702
- Senior Camera Engineer$119.434
- Senior Machine Learning Engineer$133.000
- Staff GPU Engineer$151.000
- Senior Staff CPU Engineer$179.000
- GPU Engineer$116.843
- Senior Hardware Engineer$112.882
- Staff Cellular System Test Engineer$146.328
- Staff Modem Technologies Software Engineer$146.328
- Senior Modem Technologies Software Engineer$121.597
- Camera Engineer$112.882
- Senior Cellular Technologies Engineer$114.500
Gaji adalah batas bawah dari upah yang ditawarkan pada setiap aplikasi, dikonversi menjadi jumlah tahunan; statistik hanya menggunakan aplikasi penuh waktu yang tersertifikasi. LCA bukan persetujuan visa dan satu LCA dapat mencakup beberapa posisi. Sumber: Data Pengungkapan LCA OFLC, Departemen Tenaga Kerja AS, tahun fiskal 2023–2026 (keputusan terbaru 30 Jun 2026).