Beranda › Pemberi Kerja › Qualcomm Technologies, Inc. › Senior Packaging Engineer
Gaji H-1B untuk Senior Packaging Engineer di Qualcomm Technologies, Inc.
16 aplikasi kondisi tenaga kerja untuk jabatan Senior Packaging Engineer di Qualcomm Technologies, Inc.. Gaji pokok median yang ditawarkan $123.317; setengah tengah $115.500–$128.898.
Lamaran (LCA)16
Median gaji yang ditawarkan$123.317
Setengah bagian tengah gaji$115.500–$128.898
Persentil ke-10 hingga ke-90$115.500–$128.898
Berdasarkan Tahun Fiskal
| Tahun Fiskal | LCA | Median Gaji |
|---|---|---|
| FY2023 | 3 | $115.500 |
| FY2024 | 4 | $115.500 |
| FY2025 | 4 | $127.200 |
| FY2026 | 5 | $128.898 |
Aplikasi
| Gaji Pokok | Lokasi | Diajukan | Tanggal Mulai | Status |
|---|---|---|---|---|
| $127.200–$190.800 Level II | Irvine, CA | 27 Apr 2026 | 29 Apr 2026 | Tersertifikasi |
| $128.898–$190.800 Level II | San Diego, CA | 16 Mar 2026 | 25 Agu 2026 | Tersertifikasi |
| $128.898–$190.800 Level II | San Diego, CA | 12 Jan 2026 | 25 Jun 2026 | Tersertifikasi |
| $128.898–$190.800 Level II | San Diego, CA | 11 Des 2025 | 1 Mei 2026 | Tersertifikasi |
| $128.898–$190.800 Level II | San Diego, CA | 14 Nov 2025 | 15 Nov 2025 | Tersertifikasi |
| $156.853–$209.200 Level II | Santa Clara, CA | 13 Agu 2025 | 13 Agu 2025 | Tersertifikasi |
| $127.200–$190.800 Level II | Austin, TX | 13 Agu 2025 | 13 Jan 2026 | Tersertifikasi |
| $127.200–$190.800 Level II | San Diego, CA | 4 Mar 2025 | 2 Sep 2025 | Tersertifikasi |
| $119.434–$173.500 Level II | San Diego, CA | 16 Jan 2025 | 12 Jul 2025 | Tersertifikasi |
| $115.500–$173.500 Level II | San Diego, CA | 19 Mar 2024 | 7 Jul 2024 | Tersertifikasi |
| $115.500–$173.500 Level II | San Diego, CA | 12 Mar 2024 | 7 Jul 2024 | Tersertifikasi |
| $115.500–$173.500 Level II | San Diego, CA | 20 Nov 2023 | 10 Mei 2024 | Tersertifikasi |
| $115.500–$173.500 Level II | San Diego, CA | 1 Nov 2023 | 2 Nov 2023 | Tersertifikasi |
| $115.500–$173.500 Level II | Arcadia, CA | 24 Jan 2023 | 13 Jul 2023 | Tersertifikasi |
| $115.500–$173.500 Level II | Austin, TX | 23 Jan 2023 | 13 Jul 2023 | Tersertifikasi |
| $115.500–$173.500 Level II | San Diego, CA | 23 Jan 2023 | 13 Jul 2023 | Tersertifikasi |
Senior Packaging Engineer di semua pemberi kerja →
Jabatan lain di Qualcomm Technologies, Inc.
- Senior ASICS Engineer$112.882
- Senior Software Engineer$121.597
- ASICS Engineer$109.470
- Software Engineer$111.322
- Staff ASICS Engineer$136.282
- Senior Cellular System Test Engineer$121.597
- Senior CPU Engineer$133.000
- Cellular System Test Engineer$104.290
- Staff Software Engineer$146.328
- Senior Modem Technologies Engineer$119.500
- Senior GPU Engineer$133.600
- Staff CPU Engineer$152.506
- Senior Staff ASICS Engineer$159.702
- Senior Camera Engineer$119.434
- Senior Machine Learning Engineer$133.000
- Staff GPU Engineer$151.000
- Senior Staff CPU Engineer$179.000
- GPU Engineer$116.843
- Senior Hardware Engineer$112.882
- Staff Cellular System Test Engineer$146.328
- Staff Modem Technologies Software Engineer$146.328
- Senior Modem Technologies Software Engineer$121.597
- Camera Engineer$112.882
- Senior Cellular Technologies Engineer$114.500
Gaji adalah batas bawah dari upah yang ditawarkan pada setiap aplikasi, dikonversi menjadi jumlah tahunan; statistik hanya menggunakan aplikasi penuh waktu yang tersertifikasi. LCA bukan persetujuan visa dan satu LCA dapat mencakup beberapa posisi. Sumber: Data Pengungkapan LCA OFLC, Departemen Tenaga Kerja AS, tahun fiskal 2023–2026 (keputusan terbaru 30 Jun 2026).