Laman Utama › Majikan › Micron Idaho Semiconductor Manufacturing (Triton) LLC
Micron Idaho Semiconductor Manufacturing (Triton) LLC: Gaji H-1B dan penajaan
Micron Idaho Semiconductor Manufacturing (Triton) LLC memfailkan 131 permohonan syarat buruh untuk visa H-1B dan berkaitan dalam tahun fiskal 2023–2026; disahkan: 130. Gaji median yang ditawarkan: $111,118.
Permohonan (LCA)131
Disahkan130
Alamat majikanBoise, ID
Majikan bergantung H-1BTidak
Median gaji yang ditawarkan$111,118
Separuh tengah gaji$99,005–$126,970
Persentil ke-10 hingga ke-90$95,000–$149,875
Adakah Micron Idaho Semiconductor Manufacturing (Triton) LLC menaja visa H-1B?
Micron Idaho Semiconductor Manufacturing (Triton) LLC memfailkan 131 permohonan syarat buruh dalam tahun fiskal 2023–2026, yang terkini dihantar pada 17 Jun 2026. LCA adalah langkah pertama dalam petisyen H-1B, jadi majikan telah menaja atau bersedia untuk menaja pekerja H-1B; ia tidak menjamin penajaan untuk mana-mana jawatan tertentu. Semak senarai pekerjaan majikan itu sendiri.
Gaji mengikut jawatan
| Jawatan | LCA | Gaji median |
|---|---|---|
| Semiconductor Process Engineer | 23 | $106,093 |
| Equipment Engineer | 7 | $107,000 |
| Semiconductor Facilities Engineer | 5 | $110,000 |
| Operations Improvement Engineer | 4 | $105,923 |
| Senior Semiconductor Process Engineer | 4 | $140,000 |
| Manufacturing Engineer | 3 | $96,000 |
| CMP Senior Process Engineer | 3 | $121,125 |
| ID1 Sr Program Manager | 2 | $126,640 |
| FE US Expansion Planning Engineer | 2 | $87,199 |
| Process Engineer | 2 | $109,062 |
| Senior Manager Central Probe Planning | 2 | $148,501 |
| Principal Engineer, DRAM YE/YA | 2 | $168,500 |
| Semiconductor Manufacturing Process Engineer | 2 | $94,600 |
| ATE Process Engineer | 2 | $96,000 |
| Operation Improvement Engineer | 2 | $113,564 |
| Process Integration Engineer | 2 | $111,252 |
| Sr Engineer, Process Integration | 2 | $125,000 |
| Oi Scheduling Manager | 2 | $180,747 |
| Sr. Engineer, ID1 RAM RDA APPLICATIONS | 2 | $115,891 |
| Engineer, Id1 Me - FS Equipment | 2 | $102,752 |
| Surface Scientist (Semiconductor Process Engineer 3) | 1 | $120,000 |
| Manager, FE US Expansion Planning Probe | 1 | $124,432 |
| FE US Expansion Planning Strategy Engineer | 1 | $95,000 |
| 1D1 Senior Program Manager | 1 | $135,000 |
| Id1 Senior Program Manager | 1 | $135,000 |
| CMP Process Engineer | 1 | $93,000 |
| ENGINEER - OI (Software Development Engineer 2) | 1 | $95,000 |
| Senior Process Safety Engineer | 1 | $101,000 |
| Process Safety Engineer (Semiconductor Process Engineer 2) | 1 | $90,000 |
| Facilities Capital Planner Engineer 2 | 1 | $86,500 |
| WorkForce Development Specialist | 1 | $106,575 |
| Yield Analysis Manager | 1 | $160,430 |
| Engineer-Difi Process | 1 | $104,974 |
| Ram Engineer - Id1 | 1 | $101,000 |
| Real-Time Defect Analysis Engineer | 1 | $125,000 |
| Lead Principal Engineer, Process Quality | 1 | $170,000 |
| Facilties Operations Controls Engineer | 1 | $120,000 |
| Wet Process Equipment Engineer | 1 | $92,700 |
| US Expansion Planning Engineer | 1 | $92,866 |
| Expansion Planning Engineer | 1 | $100,500 |
Permohonan mengikut tahun fiskal
| Tahun fiskal | LCA | Gaji median |
|---|---|---|
| FY2023 | 2 | $126,640 |
| FY2024 | 23 | $106,575 |
| FY2025 | 41 | $108,750 |
| FY2026 | 65 | $115,000 |
Tahap gaji lazim
- Tahap I (permulaan)12%
- Tahap II (berkelayakan)60%
- Tahap III (berpengalaman)20%
- Tahap IV (kompeten sepenuhnya)8%
Jabatan Buruh menetapkan empat tahap gaji lazim untuk setiap pekerjaan dan kawasan, dari Tahap I (permulaan) hingga Tahap IV (cekap sepenuhnya). Majikan memilih tahap yang sepadan dengan keperluan jawatan.
Lokasi pekerjaan
Pekerjaan
- Industrial Engineers43
- Materials Engineers29
- Chemical Engineers13
- Mechanical Engineers13
- Architectural and Engineering Managers10
- Electrical Engineers7
- Electronics Engineers, Except Computer7
- Civil Engineers2
- Software Developers2
- Logisticians1
Permohonan terkini
| Jawatan | Gaji asas | Lokasi | Dihantar | Tarikh mula | Status |
|---|---|---|---|---|---|
| Semiconductor Process Engineer | $100,298 Tahap II | Boise, ID | 17 Jun 2026 | 1 Okt 2026 | Disahkan |
| Senior Engineer - Manufacturing Engineering Planning | $115,000 Tahap II | Boise, ID | 16 Jun 2026 | 20 Jul 2026 | Disahkan |
| Semiconductor Process Engineer | $120,000 Tahap II | Boise, ID | 12 Jun 2026 | 29 Jun 2026 | Disahkan |
| Sr Engineer, US Expansion Planning | $113,500 Tahap II | Boise, ID | 11 Jun 2026 | 29 Jun 2026 | Disahkan |
| Senior Semiconductor Process Engineer | $149,408 Tahap IV | Boise, ID | 3 Jun 2026 | 17 Nov 2026 | Disahkan |
| Senior Equipment Engineer | $122,000 Tahap II | Boise, ID | 19 Mei 2026 | 13 Jul 2026 | Disahkan |
| HVM Project Engineer | $113,997 | Boise, ID | 14 Mei 2026 | 1 Okt 2026 | Disahkan |
| Software Development Engineer | $97,850 Tahap I | Boise, ID | 14 Mei 2026 | 14 Jun 2026 | Disahkan |
| Equipment Engineer | $97,757 Tahap II | Boise, ID | 14 Mei 2026 | 1 Okt 2026 | Disahkan |
| Semiconductor Process Engineer | $98,919 | Boise, ID | 13 Mei 2026 | 1 Okt 2026 | Disahkan |
| Process Engineer | $108,124 Tahap II | Boise, ID | 11 Mei 2026 | 1 Okt 2026 | Disahkan |
| Semiconductor Process Engineer | $120,000 Tahap II | Boise, ID | 11 Mei 2026 | 1 Okt 2026 | Disahkan |
| Engineer, Process Integration | $97,531 Tahap I | Boise, ID | 7 Mei 2026 | 1 Okt 2026 | Disahkan |
| Sr Engineer, Process Integration | $120,000 Tahap III | Boise, ID | 6 Mei 2026 | 1 Okt 2026 | Disahkan |
| Semiconductor Process Engineer | $98,688 Tahap II | Boise, ID | 6 Mei 2026 | 17 Mei 2026 | Disahkan |
| Engineer, Id1 Me - FS Equipment | $102,752 Tahap I | Boise, ID | 5 Mei 2026 | 1 Okt 2026 | Disahkan |
| Manager, Quality & Deviation Management | $148,500 Tahap II | Boise, ID | 5 Mei 2026 | 1 Okt 2026 | Disahkan |
| Oi Scheduling Manager | $180,747 Tahap II | Boise, ID | 4 Mei 2026 | 24 Mei 2026 | Disahkan |
| Process Control Engineer | $98,000 Tahap I | Boise, ID | 4 Mei 2026 | 1 Okt 2026 | Disahkan |
| Senior Manager, Id1 Manufacturing Engineering | $160,666 Tahap II | Boise, ID | 4 Mei 2026 | 1 Okt 2026 | Disahkan |
| Senior Wet Etch Equipment Engineer | $109,000 Tahap I | Boise, ID | 29 Apr 2026 | 1 Okt 2026 | Disahkan |
| Photo Equipment Engineer | $104,312 Tahap II | Boise, ID | 29 Apr 2026 | 1 Okt 2026 | Disahkan |
| DRAM Failure Analysis Engineer | $112,793 Tahap II | Boise, ID | 29 Apr 2026 | 1 Okt 2026 | Disahkan |
| ID1 Yield Analysis Engineer | $99,486 Tahap II | Boise, ID | 29 Apr 2026 | 1 Okt 2026 | Disahkan |
| Semiconductor Process Engineer | $120,000 Tahap IV | Boise, ID | 28 Apr 2026 | 1 Okt 2026 | Disahkan |
| Senior Engineer, Process Integration | $123,500 Tahap III | Boise, ID | 27 Apr 2026 | 1 Okt 2026 | Disahkan |
| Operations Improvement Engineer | $106,698 Tahap II | Boise, ID | 27 Apr 2026 | 1 Okt 2026 | Disahkan |
| Engineer, Id1 Me - FS Equipment | $102,752 Tahap II | Boise, ID | 27 Apr 2026 | 1 Okt 2026 | Disahkan |
| Sr. Engineer, ID1 RAM RDA APPLICATIONS | $120,000 Tahap II | Boise, ID | 27 Apr 2026 | 1 Okt 2026 | Disahkan |
| CMP Senior Process Engineer | $128,393 H-1B1 (Singapura) · Tahap II | Boise, ID | 22 Apr 2026 | 7 Sep 2026 | Disahkan |
| Staff Engineer, US Expansion Strategic Planning | $136,460 Tahap III | Boise, ID | 21 Apr 2026 | 24 Mei 2026 | Disahkan |
| CMP Staff Process Engineer | $128,393 Tahap IV | Boise, ID | 21 Apr 2026 | 1 Okt 2026 | Disahkan |
| Operations Improvement Engineer | $105,148 Tahap II | Boise, ID | 21 Apr 2026 | 1 Okt 2026 | Disahkan |
| Equipment Engineer | $97,799 Tahap I | Boise, ID | 21 Apr 2026 | 1 Okt 2026 | Disahkan |
| Semiconductor Process Engineer | $100,298 Tahap II | Boise, ID | 21 Apr 2026 | 1 Okt 2026 | Disahkan |
| Sr. Engineer, ID1 RAM RDA APPLICATIONS | $111,782 Tahap II | Boise, ID | 21 Apr 2026 | 1 Okt 2026 | Disahkan |
| Oi Scheduling Manager | $180,747 Tahap IV | Boise, ID | 17 Apr 2026 | 24 Mei 2026 | Disahkan |
| Operations Improvement Engineer | $107,000 Tahap II | Boise, ID | 15 Apr 2026 | 1 Okt 2026 | Disahkan |
| Semiconductor Process Engineer | $83,000 Tahap I | Boise, ID | 9 Apr 2026 | 1 Okt 2026 | Disahkan |
| Semiconductor Process Engineer | $106,093 Tahap III | Boise, ID | 7 Apr 2026 | 20 Apr 2026 | Disahkan |
| Sr Engineer, Id1 Ate De Process | $110,000 Tahap IV | Boise, ID | 1 Apr 2026 | 18 Mei 2026 | Disahkan |
| Lead Principal Engineer, Id1 Ate CMP Process | $164,052 Tahap II | Boise, ID | 25 Mac 2026 | 20 Apr 2026 | Disahkan |
| Equipment Engineer | $115,000 Tahap II | Boise, ID | 25 Mac 2026 | 20 Apr 2026 | Disahkan |
| Senior Engineer, ID1 PEE PCVD Process | $120,000 Tahap II | Boise, ID | 19 Mac 2026 | 6 Apr 2026 | Disahkan |
| Staff Engineer, Id1 Pee - PH Equipment | $127,080 Tahap III | Boise, ID | 11 Mac 2026 | 10 Sep 2026 | Disahkan |
| Sr Engineer, Process Integration | $130,000 Tahap II | Boise, ID | 10 Mac 2026 | 6 Apr 2026 | Disahkan |
| Facilities Capacity Planning Engineer | $100,707 Tahap I | Boise, ID | 10 Mac 2026 | 10 Ogo 2026 | Disahkan |
| Equipment Engineer | $140,000 Tahap III | Boise, ID | 10 Mac 2026 | 20 Apr 2026 | Disahkan |
| Wet Etch Staff Process Engineer | $154,080 Tahap II | Boise, ID | 20 Feb 2026 | 6 Apr 2026 | Disahkan |
| Photolithography Process Engineer | $95,000 Tahap II | Boise, ID | 18 Feb 2026 | 10 Ogo 2026 | Disahkan |
| Semiconductor Process Engineer | $128,000 Tahap III | Boise, ID | 18 Feb 2026 | 16 Mac 2026 | Disahkan |
| Principal Engineer Oct Adt Pee -Dry Etch | $169,906 Tahap IV | Boise, ID | 18 Feb 2026 | 31 Mei 2026 | Disahkan |
| Sr. Engineer, ID1 PEE PCVD Equipment | $130,000 H-1B1 (Singapura) · Tahap IV | Boise, ID | 17 Feb 2026 | 1 Jun 2026 | Disahkan |
| Semiconductor Process Engineer | $85,075 Tahap I | Boise, ID | 10 Feb 2026 | 3 Ogo 2026 | Disahkan |
| Semiconductor Process Engineer | $110,000 Tahap II | Boise, ID | 10 Feb 2026 | 3 Ogo 2026 | Disahkan |
| Sr Engineer, ID1 Yield Analysis | $128,000 Tahap II | Boise, ID | 10 Feb 2026 | 16 Mac 2026 | Disahkan |
| Sr. Semiconductor Process Engineer | $115,000 Tahap II | Boise, ID | 29 Jan 2026 | 17 Feb 2026 | Disahkan |
| Semiconductor Facilities Engineer | $120,000 Tahap II | Boise, ID | 28 Jan 2026 | 2 Feb 2026 | Disahkan |
| Semiconductor Manufacturing Process Engineer | $96,500 Tahap II | Boise, ID | 6 Jan 2026 | 1 Feb 2026 | Disahkan |
| Principal ID1 Program Manager | $158,601 Tahap III | Austin, TX | 30 Dis 2025 | 19 Jun 2026 | Disahkan |
| Operation Improvement Engineer | $120,599 Tahap II | San Jose, CA | 29 Dis 2025 | 5 Jan 2026 | Disahkan |
| Staff Engineer, Id1 Pee PH Process | $140,000 Tahap III | Boise, ID | 19 Dis 2025 | 5 Jan 2026 | Disahkan |
| SR. Engineer, Change Management | $112,950 Tahap III | Boise, ID | 12 Dis 2025 | 5 Jan 2026 | Disahkan |
| Equipment Engineer | $103,000 Tahap II | Boise, ID | 8 Dis 2025 | 5 Jan 2026 | Disahkan |
| Sr Engineer, F4 IE Layout | $115,000 Tahap II | Boise, ID | 18 Nov 2025 | 5 Jan 2026 | Disahkan |
| Reticle Coordinator Engineer | $139,940 Tahap IV | Boise, ID | 23 Sep 2025 | 25 Mac 2026 | Disahkan |
| Engineer, RAM Hardware ID1 | $98,000 Tahap I | Boise, ID | 23 Sep 2025 | 17 Nov 2025 | Disahkan |
| Process Integration Engingeer | $110,984 Tahap II | Boise, ID | 12 Sep 2025 | 18 Sep 2025 | Disahkan |
| Equipment Engineer | $165,000 Tahap IV | Boise, ID | 5 Sep 2025 | 6 Okt 2025 | Disahkan |
| Process Integration Engineer | $111,252 Tahap II | Boise, ID | 11 Ogo 2025 | 5 Okt 2025 | Disahkan |
| Process Integration Engineer | $111,252 Tahap II | Boise, ID | 31 Jul 2025 | 5 Okt 2025 | Ditarik balik |
| CMP Senior Process Engineer | $121,125 H-1B1 (Singapura) · Tahap III | Boise, ID | 10 Jul 2025 | 9 Dis 2025 | Disahkan |
| Lead Principal Engineer, Process Quality | $170,000 Tahap III | Boise, ID | 23 Jun 2025 | 31 Ogo 2025 | Disahkan |
| Facilties Operations Controls Engineer | $120,000 Tahap II | Boise, ID | 20 Jun 2025 | 21 Jul 2025 | Disahkan |
| Semiconductor Process Engineer | $110,000 Tahap II | Boise, ID | 16 Jun 2025 | 1 Okt 2025 | Disahkan |
| Semiconductor Process Engineer | $95,000 Tahap II | Boise, ID | 11 Jun 2025 | 1 Okt 2025 | Disahkan |
| Wet Process Equipment Engineer | $92,700 Tahap II | Boise, ID | 10 Jun 2025 | 1 Okt 2025 | Disahkan |
| Semiconductor Facilities Engineer | $98,272 Tahap III | Boise, ID | 30 Mei 2025 | 1 Okt 2025 | Disahkan |
| Semiconductor Process Engineer | $96,000 Tahap I | Boise, ID | 27 Mei 2025 | 1 Okt 2025 | Disahkan |
| US Expansion Planning Engineer | $92,866 Tahap II | Boise, ID | 27 Mei 2025 | 1 Okt 2025 | Disahkan |
| Semiconductor Process Engineer | $105,410 Tahap I | Boise, ID | 12 Mei 2025 | 1 Okt 2025 | Disahkan |
| Expansion Planning Engineer | $100,500 Tahap II | Boise, ID | 9 Mei 2025 | 1 Okt 2025 | Disahkan |
| Semiconductor Process Engineer | $107,500 Tahap II | Boise, ID | 8 Mei 2025 | 1 Okt 2025 | Disahkan |
| Equipment Engineer | $107,000 Tahap III | Boise, ID | 8 Mei 2025 | 1 Okt 2025 | Disahkan |
| Principal Engineer, DRAM YE/YA | $168,500 Tahap II | Boise, ID | 8 Mei 2025 | 7 Sep 2025 | Disahkan |
| Director, ATE Photolithography “ ID1 | $218,800 Tahap IV | Boise, ID | 7 Mei 2025 | 1 Okt 2025 | Disahkan |
| Semiconductor Facilities Engineer | $98,000 Tahap II | Boise, ID | 6 Mei 2025 | 1 Okt 2025 | Disahkan |
| Semiconductor Manufacturing Process Engineer | $92,700 Tahap II | Boise, ID | 29 Apr 2025 | 1 Okt 2025 | Disahkan |
| Senior Semiconductor Process Engineer | $96,000 Tahap I | Boise, ID | 29 Apr 2025 | 1 Okt 2025 | Disahkan |
| ATE Process Engineer | $96,000 Tahap II | Boise, ID | 24 Apr 2025 | 1 Okt 2025 | Disahkan |
| ATE Process Engineer | $96,000 Tahap I | Boise, ID | 24 Apr 2025 | 1 Okt 2025 | Disahkan |
| Manufacturing Engineer | $96,000 Tahap II | Boise, ID | 23 Apr 2025 | 1 Okt 2025 | Disahkan |
| Principal Engineer, DRAM YE/YA | $168,500 Tahap II | Boise, ID | 11 Apr 2025 | 7 Sep 2025 | Disahkan |
| Operation Improvement Engineer | $106,529 Tahap II | Boise, ID | 4 Apr 2025 | 28 Apr 2025 | Disahkan |
| Metrology Applications Engineer | $147,000 Tahap III | Boise, ID | 1 Apr 2025 | 21 Apr 2025 | Disahkan |
| Yield Analysis Manager | $160,430 Tahap II | Boise, ID | 20 Mac 2025 | 1 Apr 2025 | Disahkan |
| Engineer-Difi Process | $104,974 Tahap II | Boise, ID | 20 Feb 2025 | 22 Ogo 2025 | Disahkan |
| Ram Engineer - Id1 | $101,000 Tahap I | Boise, ID | 10 Feb 2025 | 3 Mac 2025 | Disahkan |
| Senior Manager Central Probe Planning | $148,501 Tahap III | Boise, ID | 28 Jan 2025 | 4 Feb 2025 | Disahkan |
| Senior Manager Central Probe Planning | $148,501 Tahap III | Boise, ID | 9 Jan 2025 | 4 Feb 2025 | Disahkan |
Menunjukkan 100 permohonan terkini daripada 131 permohonan.
Gaji adalah bahagian bawah gaji yang ditawarkan dalam setiap permohonan, ditukar kepada jumlah tahunan; statistik hanya menggunakan permohonan sepenuh masa yang disahkan. LCA bukan kelulusan visa dan satu LCA boleh merangkumi beberapa jawatan. Sumber: Jabatan Buruh AS, Data Pendedahan LCA OFLC, tahun fiskal 2023–2026 (keputusan terkini 30 Jun 2026).