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Packaging Engineer di Qualcomm Technologies, Inc.: Gaji H-1B
21 permohonan syarat buruh untuk jawatan Packaging Engineer di Qualcomm Technologies, Inc.. Gaji asas median yang ditawarkan $112,882; separuh tengah $108,638–$127,462.
Permohonan (LCA)21
Median gaji yang ditawarkan$112,882
Separuh tengah gaji$108,638–$127,462
Persentil ke-10 hingga ke-90$103,956–$144,000
Mengikut tahun fiskal
| Tahun fiskal | LCA | Gaji median |
|---|---|---|
| FY2023 | 7 | $108,638 |
| FY2024 | 5 | $112,882 |
| FY2025 | 5 | $119,434 |
| FY2026 | 3 | $128,898 |
Permohonan
| Gaji asas | Lokasi | Dihantar | Tarikh mula | Status |
|---|---|---|---|---|
| $156,853–$177,400 Tahap II | Santa Clara, CA | 21 Jan 2026 | 25 Jun 2026 | Disahkan |
| $110,656–$162,600 Tahap II | Austin, TX | 19 Jan 2026 | 23 Jun 2026 | Disahkan |
| $128,898–$162,600 Tahap II | San Diego, CA | 19 Jan 2026 | 23 Jun 2026 | Disahkan |
| $140,805–$177,400 | Santa Clara, CA | 11 Mac 2025 | 4 Sep 2025 | Disahkan |
| $119,434–$162,600 Tahap II | San Diego, CA | 13 Feb 2025 | 5 Ogo 2025 | Disahkan |
| $98,500–$147,500 Tahap II | Austin, TX | 30 Jan 2025 | 22 Jul 2025 | Disahkan |
| $119,434–$147,500 Tahap II | San Diego, CA | 30 Jan 2025 | 19 Jul 2025 | Disahkan |
| $119,434–$147,500 Tahap II | San Diego, CA | 30 Jan 2025 | 26 Jul 2025 | Disahkan |
| $109,470–$147,500 Tahap II | Austin, TX | 29 Mac 2024 | 10 Sep 2024 | Disahkan |
| $126,984–$169,800 Tahap II | Santa Clara, CA | 10 Mac 2024 | 13 Ogo 2024 | Disahkan |
| $112,882–$147,500 Tahap II | San Diego, CA | 12 Feb 2024 | 6 Ogo 2024 | Disahkan |
| $112,882–$147,500 Tahap II | San Diego, CA | 10 Feb 2024 | 26 Jul 2024 | Disahkan |
| $112,882–$147,500 Tahap II | San Diego, CA | 6 Feb 2024 | 19 Jul 2024 | Disahkan |
| $144,000–$216,000 Tahap II | San Diego, CA | 9 Jun 2023 | 1 Okt 2023 | Disahkan |
| $144,000–$216,000 Tahap II | San Diego, CA | 8 Jun 2023 | 1 Okt 2023 | Disahkan |
| $104,562–$147,500 Tahap II | San Diego, CA | 14 Feb 2023 | 27 Jun 2023 | Disahkan |
| $98,500–$147,500 Tahap II | Bryan, TX | 9 Feb 2023 | 27 Jun 2023 | Disahkan |
| $104,562–$147,500 Tahap II | San Diego, CA | 13 Jan 2023 | 27 Jun 2023 | Disahkan |
| $108,638–$147,500 Tahap II | Austin, TX | 4 Jan 2023 | 4 Jan 2023 | Disahkan |
| $108,638–$147,500 Tahap II | Austin, TX | 2 Jan 2023 | 4 Jan 2023 | Disahkan |
| $108,638–$147,500 Tahap II | Austin, TX | 30 Dis 2022 | 4 Jan 2023 | Ditarik balik |
Packaging Engineer di semua majikan →
Jawatan lain di Qualcomm Technologies, Inc.
- Senior ASICS Engineer$112,882
- Senior Software Engineer$121,597
- ASICS Engineer$109,470
- Software Engineer$111,322
- Staff ASICS Engineer$136,282
- Senior Cellular System Test Engineer$121,597
- Senior CPU Engineer$133,000
- Cellular System Test Engineer$104,290
- Staff Software Engineer$146,328
- Senior Modem Technologies Engineer$119,500
- Senior GPU Engineer$133,600
- Staff CPU Engineer$152,506
- Senior Staff ASICS Engineer$159,702
- Senior Camera Engineer$119,434
- Senior Machine Learning Engineer$133,000
- Staff GPU Engineer$151,000
- Senior Staff CPU Engineer$179,000
- GPU Engineer$116,843
- Senior Hardware Engineer$112,882
- Staff Cellular System Test Engineer$146,328
- Staff Modem Technologies Software Engineer$146,328
- Senior Modem Technologies Software Engineer$121,597
- Camera Engineer$112,882
- Senior Cellular Technologies Engineer$114,500
Gaji adalah bahagian bawah gaji yang ditawarkan dalam setiap permohonan, ditukar kepada jumlah tahunan; statistik hanya menggunakan permohonan sepenuh masa yang disahkan. LCA bukan kelulusan visa dan satu LCA boleh merangkumi beberapa jawatan. Sumber: Jabatan Buruh AS, Data Pendedahan LCA OFLC, tahun fiskal 2023–2026 (keputusan terkini 30 Jun 2026).