H1B Salary Data

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Lead Software Engineering: Mitengo ya H-1B

215 zofunsira za ntchito za H-1B zimagwiritsa ntchito dzina la ntchito Lead Software Engineering. Mtengo wapakati woperekedwa $160,466; gawo lapakati $155,150–$169,855.

Zofunsira (LCAs)215
Malipiro apakati operekedwa$160,466
Pakati pa malipiro$155,150–$169,855
Peresenti ya 10–90$145,000–$179,379

Ndinu loya la migwirizano, wosaka ntchito kapena wogwira ntchito? Onetsani ntchito yanu pamwamba pa tsamba ili — $99 kwa masiku 30 →

Ogwira Ntchito

Ndi lingaliro la mtengo

Gawo la malipiroMalipiro apakati
Gawo I (yayamba)$120,723
Gawo II (wololemba)$160,000
Gawo III (wokhala ndi chidziwitso)$159,490
Gawo IV (wodzidalira kwathunthu)$160,523

Department of Labor imakhazikitsa malinga anayi a prevailing wage pa ntchito iliyonse ndi dera, kuchokera pa Level I (yoyamba) kupita ku Level IV (yokhala ndi luso lonse). Wogwira ntchito amasankha malinga omwe amagwirizana zofunika za ntchito.

Ndi chaka cha ndalama

Chaka chachumaLCAsMalipiro apakati
FY20234$233,750
FY202455$160,000
FY202574$160,188
FY202680$164,458

Mizinda

Malipiro ndi otsika pa mtengo woperekedwa pa fomu iliyonse yofunsira, osinthidwa kukhala ndalama za chaka; ziwerengero zimagwiritsa ntchito zofunsira zokhala ndi ntchito yonse ya tsiku ndi tsiku zokha. LCA si chitsimikizo cha visa, ndipo LCA imodzi itha kukhala ndi malo angapo a ntchito. Chiyambi: U.S. Department of Labor, OFLC LCA Disclosure Data, zaka za ndalama 2023–2026 (zosankha zatsopano Jun 30, 2026).