H1B Salary Data

Fuula Jalqabaa › Tajaajiltoota › Dish Wireless LLC › Principal Engineer Software

Principal Engineer Software at Dish Wireless LLC: H-1B salaries

8 labor condition applications for the job title Principal Engineer Software at Dish Wireless LLC. Median offered base salary $159,494; middle half $155,766–$164,112.

Kaayyoo (LCAs)8
Gatii tajaajilaa giddu-galeessa$159,494
Harka gidduu gatiiwwan$155,766–$164,112
Sadarkaa 10ffaa–90ffaa$142,547–$164,112

Akka waggaa maallaqaaatti

Bara maallaqaaLCAsBaasii giddu-galeessaa
FY20231$120,328
FY20241$152,069
FY20266$163,051

Applications

Baasii bu'uuraaBakkaDhiyaateGuyyaa jalqabaaHaala
$164,112–$235,950
Sadarkaa IV
Denver, CO13-Cam-202601-Onk-2026Mirkaneffame
$164,112–$235,950
Sadarkaa IV
Denver, CO27-Elb-202623-Onk-2026Mirkaneffame
$164,112–$235,950
Sadarkaa IV
Denver, CO20-Elb-202601-Onk-2026Mirkaneffame
$156,998–$235,950
Sadarkaa IV
Plano, TX07-Elb-202602-Onk-2026Mirkaneffame
$156,998–$235,950
Sadarkaa IV
Plano, TX22-Ama-202624-Ado-2026Mirkaneffame
$161,990–$235,950
Sadarkaa IV
Englewood, CO14-Ama-202626-Ama-2026Mirkaneffame
$152,069–$214,500
Sadarkaa IV
Denver, CO06-Onk-202323-Onk-2023Mirkaneffame
$120,328–$214,500
Sadarkaa III
Plano, TX22-Ful-202302-Onk-2023Mirkaneffame

Principal Engineer Software at all employers →

Other jobs at Dish Wireless LLC

Baajanni gatii gadii gatii hojii iyyannoo tokkoo tokkoon irratti dhiyaate yoo ta'u, gara baajannaa waggaatti jijjiirame; lakkoofsa hojii guutuu hamma guyyaa guutuu qofa fayyadama. LCA mirkaneessa viizaa miti; LCA tokko hojii hedduu haguuchuuf ni danda'a. Madda: Dhaabbata Hojii Ameerikaa, OFLC LCA Disclosure Data, bara maallaqaa 2023–2026 (murtii haaraa 30-Wax-2026).