H1B Salary Data

Fuula Jalqabaa › Tajaajiltoota › HP Inc. › Software Firmware Engineer 3

Software Firmware Engineer 3 at HP Inc.: H-1B salaries

7 labor condition applications for the job title Software Firmware Engineer 3 at HP Inc.. Median offered base salary $117,915; middle half $113,412–$133,588.

Kaayyoo (LCAs)7
Gatii tajaajilaa giddu-galeessa$117,915
Harka gidduu gatiiwwan$113,412–$133,588
Sadarkaa 10ffaa–90ffaa$107,253–$145,650

Akka waggaa maallaqaaatti

Bara maallaqaaLCAsBaasii giddu-galeessaa
FY20231$155,397
FY20241$117,915
FY20251$112,070
FY20264$121,389

Applications

Baasii bu'uuraaBakkaDhiyaateGuyyaa jalqabaaHaala
$128,024–$155,000
Sadarkaa III
Boise, ID17-Wax-202614-Hag-2026Mirkaneffame
$114,754–$185,000
Sadarkaa II
Austin, TX26-Cam-202601-Onk-2026Mirkaneffame
$139,152–$185,000
Sadarkaa III
Austin, TX02-Bit-202628-Hag-2026Mirkaneffame
$100,027–$155,000
Sadarkaa II
Boise, ID20-Gur-202614-Hag-2026Mirkaneffame
$112,070–$142,384
Sadarkaa II
Vancouver, WA09-Ama-202516-Wax-2025Mirkaneffame
$117,915–$137,915
Sadarkaa IV
Fort Collins, CO11-Elb-202401-Onk-2024Mirkaneffame
$155,397
Sadarkaa IV
San Diego, CA31-Bit-202310-Ful-2023Mirkaneffame

Other jobs at HP Inc.

Baajanni gatii gadii gatii hojii iyyannoo tokkoo tokkoon irratti dhiyaate yoo ta'u, gara baajannaa waggaatti jijjiirame; lakkoofsa hojii guutuu hamma guyyaa guutuu qofa fayyadama. LCA mirkaneessa viizaa miti; LCA tokko hojii hedduu haguuchuuf ni danda'a. Madda: Dhaabbata Hojii Ameerikaa, OFLC LCA Disclosure Data, bara maallaqaa 2023–2026 (murtii haaraa 30-Wax-2026).