H1B Salary Data

Fuula Jalqabaa › Tajaajiltoota › Intel Corporation › Packaging R&D Engineer

Packaging R&D Engineer at Intel Corporation: H-1B salaries

5 labor condition applications for the job title Packaging R&D Engineer at Intel Corporation. Median offered base salary $179,650; middle half $177,200–$181,314.

Kaayyoo (LCAs)5
Gatii tajaajilaa giddu-galeessa$179,650
Harka gidduu gatiiwwan$177,200–$181,314
Sadarkaa 10ffaa–90ffaa$167,550–$187,729

Akka waggaa maallaqaaatti

Bara maallaqaaLCAsBaasii giddu-galeessaa
FY20231$161,117
FY20241$179,650
FY20253$181,314

Applications

Baasii bu'uuraaBakkaDhiyaateGuyyaa jalqabaaHaala
$192,005–$241,880
Sadarkaa III
Austin, TX31-Ado-202501-Onk-2025Mirkaneffame
$181,314–$250,160
Sadarkaa III
Round Rock, TX03-Wax-202501-Onk-2025Mirkaneffame
$177,200–$250,160
Sadarkaa III
Chandler, AZ23-Elb-202501-Onk-2025Mirkaneffame
$179,650–$221,610
Sadarkaa IV
Chandler, AZ14-Bit-202428-Hag-2024Mirkaneffame
$161,117–$221,610
Sadarkaa III
Chandler, AZ16-Bit-202308-Ful-2023Mirkaneffame

Other jobs at Intel Corporation

Baajanni gatii gadii gatii hojii iyyannoo tokkoo tokkoon irratti dhiyaate yoo ta'u, gara baajannaa waggaatti jijjiirame; lakkoofsa hojii guutuu hamma guyyaa guutuu qofa fayyadama. LCA mirkaneessa viizaa miti; LCA tokko hojii hedduu haguuchuuf ni danda'a. Madda: Dhaabbata Hojii Ameerikaa, OFLC LCA Disclosure Data, bara maallaqaa 2023–2026 (murtii haaraa 30-Wax-2026).