Fuula Jalqabaa › Tajaajiltoota › Microchip Technology Inc. › Product Engineer
Product Engineer at Microchip Technology Inc.: H-1B salaries
6 labor condition applications for the job title Product Engineer at Microchip Technology Inc.. Median offered base salary $101,993; middle half $89,274–$102,960.
Kaayyoo (LCAs)6
Gatii tajaajilaa giddu-galeessa$101,993
Harka gidduu gatiiwwan$89,274–$102,960
Sadarkaa 10ffaa–90ffaa$75,459–$115,097
Akka waggaa maallaqaaatti
| Bara maallaqaa | LCAs | Baasii giddu-galeessaa |
|---|---|---|
| FY2023 | 2 | $83,294 |
| FY2026 | 4 | $102,960 |
Applications
| Baasii bu'uuraa | Bakka | Dhiyaate | Guyyaa jalqabaa | Haala |
|---|---|---|---|---|
| $127,234–$130,000 Sadarkaa I | San Jose, CA | 22-Cam-2026 | 01-Onk-2026 | Mirkaneffame |
| $102,960–$124,478 Sadarkaa II | Colorado Springs, CO | 22-Cam-2026 | 01-Onk-2026 | Mirkaneffame |
| $102,960–$124,478 Sadarkaa II | Colorado Springs, CO | 22-Cam-2026 | 01-Onk-2026 | Mirkaneffame |
| $85,356–$92,214 Sadarkaa I | Chandler, AZ | 29-Elb-2026 | 01-Onk-2026 | Mirkaneffame |
| $101,026–$163,000 Sadarkaa I | San Jose, CA | 28-Bit-2023 | 05-Ful-2023 | Mirkaneffame |
| $65,562–$86,517 Sadarkaa I | Chandler, AZ | 07-Gur-2020 | 02-Hag-2020 | Mirkaneffame, erga haqamee |
Product Engineer at all employers →
Other jobs at Microchip Technology Inc.
- Engineer II - Applications$81,747
- Engineer II - Design$79,500
- Software Engineer$93,146
- Applications Engineer$88,846
- Verification Engineer$89,731
- Senior Engineer I - Design$90,522
- Principal Engineer - Firmware$134,493
- Engineer II - Validation$77,397
- Design Engineer$75,358
- Technical Staff Engineer - Applications$128,263
- Test Engineer$96,346
- Engineer II - Software$81,744
- Senior Engineer II - Applications$126,000
- Engineer II - Analog Design$83,678
Baajanni gatii gadii gatii hojii iyyannoo tokkoo tokkoon irratti dhiyaate yoo ta'u, gara baajannaa waggaatti jijjiirame; lakkoofsa hojii guutuu hamma guyyaa guutuu qofa fayyadama. LCA mirkaneessa viizaa miti; LCA tokko hojii hedduu haguuchuuf ni danda'a. Madda: Dhaabbata Hojii Ameerikaa, OFLC LCA Disclosure Data, bara maallaqaa 2023–2026 (murtii haaraa 30-Wax-2026).