H1B Salary Data

Fuula Jalqabaa › Tajaajiltoota › NXP USA, Inc. › Semiconductor Packaging Engineer

Semiconductor Packaging Engineer at NXP USA, Inc.: H-1B salaries

8 labor condition applications for the job title Semiconductor Packaging Engineer at NXP USA, Inc.. Median offered base salary $137,700; middle half $125,000–$147,897.

Kaayyoo (LCAs)8
Gatii tajaajilaa giddu-galeessa$137,700
Harka gidduu gatiiwwan$125,000–$147,897
Sadarkaa 10ffaa–90ffaa$100,040–$152,367

Akka waggaa maallaqaaatti

Bara maallaqaaLCAsBaasii giddu-galeessaa
FY20234$120,000
FY20253$151,012
FY20261$145,400

Applications

Baasii bu'uuraaBakkaDhiyaateGuyyaa jalqabaaHaala
$145,400
Sadarkaa II
Austin, TX15-Elb-202601-Onk-2026Mirkaneffame
$146,859
Sadarkaa IV
Austin, TX21-Cam-202501-Onk-2025Mirkaneffame
$155,530
Sadarkaa II
Austin, TX02-Cam-202501-Onk-2025Mirkaneffame
$151,012
Sadarkaa III
Austin, TX15-Sad-202402-Mud-2024Mirkaneffame
$110,000
Sadarkaa II
Austin, TX04-Hag-202301-Onk-2023Mirkaneffame
$76,800
Sadarkaa I
Austin, TX17-Cam-202301-Onk-2023Mirkaneffame
$130,000
Sadarkaa II
Austin, TX17-Elb-202301-Onk-2023Mirkaneffame
$130,000
Sadarkaa II
Chandler, AZ12-Elb-202306-Hag-2023Mirkaneffame

Other jobs at NXP USA, Inc.

Baajanni gatii gadii gatii hojii iyyannoo tokkoo tokkoon irratti dhiyaate yoo ta'u, gara baajannaa waggaatti jijjiirame; lakkoofsa hojii guutuu hamma guyyaa guutuu qofa fayyadama. LCA mirkaneessa viizaa miti; LCA tokko hojii hedduu haguuchuuf ni danda'a. Madda: Dhaabbata Hojii Ameerikaa, OFLC LCA Disclosure Data, bara maallaqaa 2023–2026 (murtii haaraa 30-Wax-2026).