H1B Salary Data

Fuula Jalqabaa › Tajaajiltoota › Samsung Electronics America, Inc. › Engineer I, Software Analysis Engineering

Engineer I, Software Analysis Engineering at Samsung Electronics America, Inc.: H-1B salaries

8 labor condition applications for the job title Engineer I, Software Analysis Engineering at Samsung Electronics America, Inc.. Median offered base salary $109,116; middle half $104,500–$117,250.

Kaayyoo (LCAs)8
Gatii tajaajilaa giddu-galeessa$109,116
Harka gidduu gatiiwwan$104,500–$117,250
Sadarkaa 10ffaa–90ffaa$97,387–$121,900

Akka waggaa maallaqaaatti

Bara maallaqaaLCAsBaasii giddu-galeessaa
FY20234$103,000
FY20242$124,000
FY20262$114,616

Applications

Baasii bu'uuraaBakkaDhiyaateGuyyaa jalqabaaHaala
$118,000–$128,000
Sadarkaa II
Plano, TX29-Elb-202611-Cam-2026Mirkaneffame
$111,232
Sadarkaa III
Plano, TX17-Bit-202609-Ful-2026Mirkaneffame
$131,000–$141,000
Sadarkaa II
Plano, TX18-Ado-202401-Hag-2024Mirkaneffame
$117,000–$127,000
Sadarkaa II
Plano, TX09-Ado-202418-Ado-2024Mirkaneffame, erga haqamee
$106,000–$116,000
Sadarkaa II
Plano, TX09-Cam-202301-Onk-2023Mirkaneffame
$100,000–$110,000
Sadarkaa II
Plano, TX17-Elb-202301-Onk-2023Mirkaneffame
$91,291–$120,000
Sadarkaa III
Plano, TX11-Elb-202301-Onk-2023Mirkaneffame
$107,000–$140,000
Sadarkaa II
Plano, TX09-Hag-202101-Onk-2021Mirkaneffame, erga haqamee

Other jobs at Samsung Electronics America, Inc.

Baajanni gatii gadii gatii hojii iyyannoo tokkoo tokkoon irratti dhiyaate yoo ta'u, gara baajannaa waggaatti jijjiirame; lakkoofsa hojii guutuu hamma guyyaa guutuu qofa fayyadama. LCA mirkaneessa viizaa miti; LCA tokko hojii hedduu haguuchuuf ni danda'a. Madda: Dhaabbata Hojii Ameerikaa, OFLC LCA Disclosure Data, bara maallaqaa 2023–2026 (murtii haaraa 30-Wax-2026).