Fuula Jalqabaa › Hojiiwwan › Materials Engineers › Hillsboro, OR
Materials Engineers in Hillsboro, OR: H-1B salaries
2,118 labor condition applications for this occupation with a work site in Hillsboro, OR. Median offered base salary $115,482; middle half $96,013–$130,291.
Akka sadarkaa mindaatti
| Sadarkaa baasii | Baasii giddu-galeessaa |
|---|---|
| Sadarkaa I (jalqabsiisa) | $95,202 |
| Sadarkaa II (qajeelaa) | $103,334 |
| Sadarkaa III (muuxannoo qabu) | $120,640 |
| Sadarkaa IV (gahumsa guutuu) | $147,846 |
Dhaabbanni Hojii sadarkaa baajannaa olaanaa afur hojii tokkoo tokkoo fi bakkaaf, Sadarkaa I (jalqabaa) hanga Sadarkaa IV (guddisaa) jiru, kaa'a. Hojii kennaan sadarkaa hojii sanaaf madaalu filata.
Employers
| Tajaajilaa | LCAs | Baasii giddu-galeessaa |
|---|---|---|
| Intel Corporation | 2,067 | $115,482 |
| Lam Research Corporation | 12 | $125,466 |
| Asm America Inc. | 11 | $112,715 |
| Applied Materials, Inc | 10 | $129,911 |
| Thermo Fisher Scientific Inc. | 4 | $111,667 |
| Hitachi High-Tech America, Inc. | 3 | $133,864 |
| KLA Corporation | 3 | $105,672 |
| CMC Materials, Inc. | 2 | $104,624 |
| Nova Measuring Instruments Inc. | 2 | $126,358 |
| Asml US, LP | 1 | $115,482 |
| Intel NDTM US LLC | 1 | $108,467 |
| Intel Americas, Inc. | 1 | $77,248 |
| Jireh Semiconductor, Inc. | 1 | $95,202 |
Mata dureewwan hojii
- Process Engineer2,050
- Packaging Engineer18
- Field Process Engineer11
- Process Support Engineer10
- Process Engineer IV3
- Product Development Engineer3
- Field Process Engineer II3
- Snr Field Process Engineer I3
- Senior Field Process Engineer I3
- Materials Engineer2
- Application Scientist2
- Senior Applications Engineer 21
- Research Scientist1
- Engineer III, Field Applications1
- Scientist III, Field Applications1
H-1B sponsors in Hillsboro, OR →
Baajanni gatii gadii gatii hojii iyyannoo tokkoo tokkoon irratti dhiyaate yoo ta'u, gara baajannaa waggaatti jijjiirame; lakkoofsa hojii guutuu hamma guyyaa guutuu qofa fayyadama. LCA mirkaneessa viizaa miti; LCA tokko hojii hedduu haguuchuuf ni danda'a. Madda: Dhaabbata Hojii Ameerikaa, OFLC LCA Disclosure Data, bara maallaqaa 2023–2026 (murtii haaraa 30-Wax-2026).