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Micron Idaho Semiconductor Manufacturing (Triton) LLC: H-1B plate i sponzorstvo
Micron Idaho Semiconductor Manufacturing (Triton) LLC je podneo 131 prijava za radne uslove za H-1B i srodne vize u fiskalnim godinama 2023–2026; sertifikovano: 130. Medijalna ponuđena plata: $111.118.
Пријаве (LCA)131
Сертификовано130
Адреса послодавцаBoise, ID
Послодавац зависан од H-1BНе
Медијанска понуђена плата$111.118
Средина распона плата$99.005–$126.970
10.–90. перцентил$95.000–$149.875
Da li Micron Idaho Semiconductor Manufacturing (Triton) LLC sponzoriše H-1B vize?
Micron Idaho Semiconductor Manufacturing (Triton) LLC je podneo 131 prijava za radne uslove u fiskalnim godinama 2023–2026, poslednja podneta 17. 6. 2026.. LCA je prvi korak H-1B prijave, što znači da je poslodavac sponzorisao ili pripremio sponzorstvo za H-1B radnike; to ne garantuje sponzorstvo za bilo koju konkretnu poziciju. Proverite oglase za posao samog poslodavca.
Плате по називу радног места
| Назив позиције | LCA | Медијална плата |
|---|---|---|
| Semiconductor Process Engineer | 23 | $106.093 |
| Equipment Engineer | 7 | $107.000 |
| Semiconductor Facilities Engineer | 5 | $110.000 |
| Operations Improvement Engineer | 4 | $105.923 |
| Senior Semiconductor Process Engineer | 4 | $140.000 |
| Manufacturing Engineer | 3 | $96.000 |
| CMP Senior Process Engineer | 3 | $121.125 |
| ID1 Sr Program Manager | 2 | $126.640 |
| FE US Expansion Planning Engineer | 2 | $87.199 |
| Process Engineer | 2 | $109.062 |
| Senior Manager Central Probe Planning | 2 | $148.501 |
| Principal Engineer, DRAM YE/YA | 2 | $168.500 |
| Semiconductor Manufacturing Process Engineer | 2 | $94.600 |
| ATE Process Engineer | 2 | $96.000 |
| Operation Improvement Engineer | 2 | $113.564 |
| Process Integration Engineer | 2 | $111.252 |
| Sr Engineer, Process Integration | 2 | $125.000 |
| Oi Scheduling Manager | 2 | $180.747 |
| Sr. Engineer, ID1 RAM RDA APPLICATIONS | 2 | $115.891 |
| Engineer, Id1 Me - FS Equipment | 2 | $102.752 |
| Surface Scientist (Semiconductor Process Engineer 3) | 1 | $120.000 |
| Manager, FE US Expansion Planning Probe | 1 | $124.432 |
| FE US Expansion Planning Strategy Engineer | 1 | $95.000 |
| 1D1 Senior Program Manager | 1 | $135.000 |
| Id1 Senior Program Manager | 1 | $135.000 |
| CMP Process Engineer | 1 | $93.000 |
| ENGINEER - OI (Software Development Engineer 2) | 1 | $95.000 |
| Senior Process Safety Engineer | 1 | $101.000 |
| Process Safety Engineer (Semiconductor Process Engineer 2) | 1 | $90.000 |
| Facilities Capital Planner Engineer 2 | 1 | $86.500 |
| WorkForce Development Specialist | 1 | $106.575 |
| Yield Analysis Manager | 1 | $160.430 |
| Engineer-Difi Process | 1 | $104.974 |
| Ram Engineer - Id1 | 1 | $101.000 |
| Real-Time Defect Analysis Engineer | 1 | $125.000 |
| Lead Principal Engineer, Process Quality | 1 | $170.000 |
| Facilties Operations Controls Engineer | 1 | $120.000 |
| Wet Process Equipment Engineer | 1 | $92.700 |
| US Expansion Planning Engineer | 1 | $92.866 |
| Expansion Planning Engineer | 1 | $100.500 |
Пријаве по фискалним годинама
| Фискална година | LCA | Медијална плата |
|---|---|---|
| ФГ2023 | 2 | $126.640 |
| ФГ2024 | 23 | $106.575 |
| ФГ2025 | 41 | $108.750 |
| ФГ2026 | 65 | $115.000 |
Нивои тржишне плате
Ministarstvo rada određuje četiri nivoa važeće plate za svako zanimanje i oblast, od Nivoa I (početni) do Nivoa IV (potpuno kompetentan). Poslodavac bira nivo koji odgovara zahtevima posla.
Где се налазе послови
Занимања
- Industrial Engineers43
- Materials Engineers29
- Chemical Engineers13
- Mechanical Engineers13
- Architectural and Engineering Managers10
- Electrical Engineers7
- Electronics Engineers, Except Computer7
- Civil Engineers2
- Software Developers2
- Logisticians1
Најновије пријаве
| Назив позиције | Основна плата | Локација | Послато | Датум почетка | Статус |
|---|---|---|---|---|---|
| Semiconductor Process Engineer | $100.298 Ниво II | Boise, ID | 17. 6. 2026. | 1. 10. 2026. | Сертификовано |
| Senior Engineer - Manufacturing Engineering Planning | $115.000 Ниво II | Boise, ID | 16. 6. 2026. | 20. 7. 2026. | Сертификовано |
| Semiconductor Process Engineer | $120.000 Ниво II | Boise, ID | 12. 6. 2026. | 29. 6. 2026. | Сертификовано |
| Sr Engineer, US Expansion Planning | $113.500 Ниво II | Boise, ID | 11. 6. 2026. | 29. 6. 2026. | Сертификовано |
| Senior Semiconductor Process Engineer | $149.408 Ниво IV | Boise, ID | 3. 6. 2026. | 17. 11. 2026. | Сертификовано |
| Senior Equipment Engineer | $122.000 Ниво II | Boise, ID | 19. 5. 2026. | 13. 7. 2026. | Сертификовано |
| HVM Project Engineer | $113.997 | Boise, ID | 14. 5. 2026. | 1. 10. 2026. | Сертификовано |
| Software Development Engineer | $97.850 Ниво I | Boise, ID | 14. 5. 2026. | 14. 6. 2026. | Сертификовано |
| Equipment Engineer | $97.757 Ниво II | Boise, ID | 14. 5. 2026. | 1. 10. 2026. | Сертификовано |
| Semiconductor Process Engineer | $98.919 | Boise, ID | 13. 5. 2026. | 1. 10. 2026. | Сертификовано |
| Process Engineer | $108.124 Ниво II | Boise, ID | 11. 5. 2026. | 1. 10. 2026. | Сертификовано |
| Semiconductor Process Engineer | $120.000 Ниво II | Boise, ID | 11. 5. 2026. | 1. 10. 2026. | Сертификовано |
| Engineer, Process Integration | $97.531 Ниво I | Boise, ID | 7. 5. 2026. | 1. 10. 2026. | Сертификовано |
| Sr Engineer, Process Integration | $120.000 Ниво III | Boise, ID | 6. 5. 2026. | 1. 10. 2026. | Сертификовано |
| Semiconductor Process Engineer | $98.688 Ниво II | Boise, ID | 6. 5. 2026. | 17. 5. 2026. | Сертификовано |
| Engineer, Id1 Me - FS Equipment | $102.752 Ниво I | Boise, ID | 5. 5. 2026. | 1. 10. 2026. | Сертификовано |
| Manager, Quality & Deviation Management | $148.500 Ниво II | Boise, ID | 5. 5. 2026. | 1. 10. 2026. | Сертификовано |
| Oi Scheduling Manager | $180.747 Ниво II | Boise, ID | 4. 5. 2026. | 24. 5. 2026. | Сертификовано |
| Process Control Engineer | $98.000 Ниво I | Boise, ID | 4. 5. 2026. | 1. 10. 2026. | Сертификовано |
| Senior Manager, Id1 Manufacturing Engineering | $160.666 Ниво II | Boise, ID | 4. 5. 2026. | 1. 10. 2026. | Сертификовано |
| Senior Wet Etch Equipment Engineer | $109.000 Ниво I | Boise, ID | 29. 4. 2026. | 1. 10. 2026. | Сертификовано |
| Photo Equipment Engineer | $104.312 Ниво II | Boise, ID | 29. 4. 2026. | 1. 10. 2026. | Сертификовано |
| DRAM Failure Analysis Engineer | $112.793 Ниво II | Boise, ID | 29. 4. 2026. | 1. 10. 2026. | Сертификовано |
| ID1 Yield Analysis Engineer | $99.486 Ниво II | Boise, ID | 29. 4. 2026. | 1. 10. 2026. | Сертификовано |
| Semiconductor Process Engineer | $120.000 Ниво IV | Boise, ID | 28. 4. 2026. | 1. 10. 2026. | Сертификовано |
| Senior Engineer, Process Integration | $123.500 Ниво III | Boise, ID | 27. 4. 2026. | 1. 10. 2026. | Сертификовано |
| Operations Improvement Engineer | $106.698 Ниво II | Boise, ID | 27. 4. 2026. | 1. 10. 2026. | Сертификовано |
| Engineer, Id1 Me - FS Equipment | $102.752 Ниво II | Boise, ID | 27. 4. 2026. | 1. 10. 2026. | Сертификовано |
| Sr. Engineer, ID1 RAM RDA APPLICATIONS | $120.000 Ниво II | Boise, ID | 27. 4. 2026. | 1. 10. 2026. | Сертификовано |
| CMP Senior Process Engineer | $128.393 H-1B1 (Сингапур) · Ниво II | Boise, ID | 22. 4. 2026. | 7. 9. 2026. | Сертификовано |
| Staff Engineer, US Expansion Strategic Planning | $136.460 Ниво III | Boise, ID | 21. 4. 2026. | 24. 5. 2026. | Сертификовано |
| CMP Staff Process Engineer | $128.393 Ниво IV | Boise, ID | 21. 4. 2026. | 1. 10. 2026. | Сертификовано |
| Operations Improvement Engineer | $105.148 Ниво II | Boise, ID | 21. 4. 2026. | 1. 10. 2026. | Сертификовано |
| Equipment Engineer | $97.799 Ниво I | Boise, ID | 21. 4. 2026. | 1. 10. 2026. | Сертификовано |
| Semiconductor Process Engineer | $100.298 Ниво II | Boise, ID | 21. 4. 2026. | 1. 10. 2026. | Сертификовано |
| Sr. Engineer, ID1 RAM RDA APPLICATIONS | $111.782 Ниво II | Boise, ID | 21. 4. 2026. | 1. 10. 2026. | Сертификовано |
| Oi Scheduling Manager | $180.747 Ниво IV | Boise, ID | 17. 4. 2026. | 24. 5. 2026. | Сертификовано |
| Operations Improvement Engineer | $107.000 Ниво II | Boise, ID | 15. 4. 2026. | 1. 10. 2026. | Сертификовано |
| Semiconductor Process Engineer | $83.000 Ниво I | Boise, ID | 9. 4. 2026. | 1. 10. 2026. | Сертификовано |
| Semiconductor Process Engineer | $106.093 Ниво III | Boise, ID | 7. 4. 2026. | 20. 4. 2026. | Сертификовано |
| Sr Engineer, Id1 Ate De Process | $110.000 Ниво IV | Boise, ID | 1. 4. 2026. | 18. 5. 2026. | Сертификовано |
| Lead Principal Engineer, Id1 Ate CMP Process | $164.052 Ниво II | Boise, ID | 25. 3. 2026. | 20. 4. 2026. | Сертификовано |
| Equipment Engineer | $115.000 Ниво II | Boise, ID | 25. 3. 2026. | 20. 4. 2026. | Сертификовано |
| Senior Engineer, ID1 PEE PCVD Process | $120.000 Ниво II | Boise, ID | 19. 3. 2026. | 6. 4. 2026. | Сертификовано |
| Staff Engineer, Id1 Pee - PH Equipment | $127.080 Ниво III | Boise, ID | 11. 3. 2026. | 10. 9. 2026. | Сертификовано |
| Sr Engineer, Process Integration | $130.000 Ниво II | Boise, ID | 10. 3. 2026. | 6. 4. 2026. | Сертификовано |
| Facilities Capacity Planning Engineer | $100.707 Ниво I | Boise, ID | 10. 3. 2026. | 10. 8. 2026. | Сертификовано |
| Equipment Engineer | $140.000 Ниво III | Boise, ID | 10. 3. 2026. | 20. 4. 2026. | Сертификовано |
| Wet Etch Staff Process Engineer | $154.080 Ниво II | Boise, ID | 20. 2. 2026. | 6. 4. 2026. | Сертификовано |
| Photolithography Process Engineer | $95.000 Ниво II | Boise, ID | 18. 2. 2026. | 10. 8. 2026. | Сертификовано |
| Semiconductor Process Engineer | $128.000 Ниво III | Boise, ID | 18. 2. 2026. | 16. 3. 2026. | Сертификовано |
| Principal Engineer Oct Adt Pee -Dry Etch | $169.906 Ниво IV | Boise, ID | 18. 2. 2026. | 31. 5. 2026. | Сертификовано |
| Sr. Engineer, ID1 PEE PCVD Equipment | $130.000 H-1B1 (Сингапур) · Ниво IV | Boise, ID | 17. 2. 2026. | 1. 6. 2026. | Сертификовано |
| Semiconductor Process Engineer | $85.075 Ниво I | Boise, ID | 10. 2. 2026. | 3. 8. 2026. | Сертификовано |
| Semiconductor Process Engineer | $110.000 Ниво II | Boise, ID | 10. 2. 2026. | 3. 8. 2026. | Сертификовано |
| Sr Engineer, ID1 Yield Analysis | $128.000 Ниво II | Boise, ID | 10. 2. 2026. | 16. 3. 2026. | Сертификовано |
| Sr. Semiconductor Process Engineer | $115.000 Ниво II | Boise, ID | 29. 1. 2026. | 17. 2. 2026. | Сертификовано |
| Semiconductor Facilities Engineer | $120.000 Ниво II | Boise, ID | 28. 1. 2026. | 2. 2. 2026. | Сертификовано |
| Semiconductor Manufacturing Process Engineer | $96.500 Ниво II | Boise, ID | 6. 1. 2026. | 1. 2. 2026. | Сертификовано |
| Principal ID1 Program Manager | $158.601 Ниво III | Austin, TX | 30. 12. 2025. | 19. 6. 2026. | Сертификовано |
| Operation Improvement Engineer | $120.599 Ниво II | San Jose, CA | 29. 12. 2025. | 5. 1. 2026. | Сертификовано |
| Staff Engineer, Id1 Pee PH Process | $140.000 Ниво III | Boise, ID | 19. 12. 2025. | 5. 1. 2026. | Сертификовано |
| SR. Engineer, Change Management | $112.950 Ниво III | Boise, ID | 12. 12. 2025. | 5. 1. 2026. | Сертификовано |
| Equipment Engineer | $103.000 Ниво II | Boise, ID | 8. 12. 2025. | 5. 1. 2026. | Сертификовано |
| Sr Engineer, F4 IE Layout | $115.000 Ниво II | Boise, ID | 18. 11. 2025. | 5. 1. 2026. | Сертификовано |
| Reticle Coordinator Engineer | $139.940 Ниво IV | Boise, ID | 23. 9. 2025. | 25. 3. 2026. | Сертификовано |
| Engineer, RAM Hardware ID1 | $98.000 Ниво I | Boise, ID | 23. 9. 2025. | 17. 11. 2025. | Сертификовано |
| Process Integration Engingeer | $110.984 Ниво II | Boise, ID | 12. 9. 2025. | 18. 9. 2025. | Сертификовано |
| Equipment Engineer | $165.000 Ниво IV | Boise, ID | 5. 9. 2025. | 6. 10. 2025. | Сертификовано |
| Process Integration Engineer | $111.252 Ниво II | Boise, ID | 11. 8. 2025. | 5. 10. 2025. | Сертификовано |
| Process Integration Engineer | $111.252 Ниво II | Boise, ID | 31. 7. 2025. | 5. 10. 2025. | Повучено |
| CMP Senior Process Engineer | $121.125 H-1B1 (Сингапур) · Ниво III | Boise, ID | 10. 7. 2025. | 9. 12. 2025. | Сертификовано |
| Lead Principal Engineer, Process Quality | $170.000 Ниво III | Boise, ID | 23. 6. 2025. | 31. 8. 2025. | Сертификовано |
| Facilties Operations Controls Engineer | $120.000 Ниво II | Boise, ID | 20. 6. 2025. | 21. 7. 2025. | Сертификовано |
| Semiconductor Process Engineer | $110.000 Ниво II | Boise, ID | 16. 6. 2025. | 1. 10. 2025. | Сертификовано |
| Semiconductor Process Engineer | $95.000 Ниво II | Boise, ID | 11. 6. 2025. | 1. 10. 2025. | Сертификовано |
| Wet Process Equipment Engineer | $92.700 Ниво II | Boise, ID | 10. 6. 2025. | 1. 10. 2025. | Сертификовано |
| Semiconductor Facilities Engineer | $98.272 Ниво III | Boise, ID | 30. 5. 2025. | 1. 10. 2025. | Сертификовано |
| Semiconductor Process Engineer | $96.000 Ниво I | Boise, ID | 27. 5. 2025. | 1. 10. 2025. | Сертификовано |
| US Expansion Planning Engineer | $92.866 Ниво II | Boise, ID | 27. 5. 2025. | 1. 10. 2025. | Сертификовано |
| Semiconductor Process Engineer | $105.410 Ниво I | Boise, ID | 12. 5. 2025. | 1. 10. 2025. | Сертификовано |
| Expansion Planning Engineer | $100.500 Ниво II | Boise, ID | 9. 5. 2025. | 1. 10. 2025. | Сертификовано |
| Semiconductor Process Engineer | $107.500 Ниво II | Boise, ID | 8. 5. 2025. | 1. 10. 2025. | Сертификовано |
| Equipment Engineer | $107.000 Ниво III | Boise, ID | 8. 5. 2025. | 1. 10. 2025. | Сертификовано |
| Principal Engineer, DRAM YE/YA | $168.500 Ниво II | Boise, ID | 8. 5. 2025. | 7. 9. 2025. | Сертификовано |
| Director, ATE Photolithography “ ID1 | $218.800 Ниво IV | Boise, ID | 7. 5. 2025. | 1. 10. 2025. | Сертификовано |
| Semiconductor Facilities Engineer | $98.000 Ниво II | Boise, ID | 6. 5. 2025. | 1. 10. 2025. | Сертификовано |
| Semiconductor Manufacturing Process Engineer | $92.700 Ниво II | Boise, ID | 29. 4. 2025. | 1. 10. 2025. | Сертификовано |
| Senior Semiconductor Process Engineer | $96.000 Ниво I | Boise, ID | 29. 4. 2025. | 1. 10. 2025. | Сертификовано |
| ATE Process Engineer | $96.000 Ниво II | Boise, ID | 24. 4. 2025. | 1. 10. 2025. | Сертификовано |
| ATE Process Engineer | $96.000 Ниво I | Boise, ID | 24. 4. 2025. | 1. 10. 2025. | Сертификовано |
| Manufacturing Engineer | $96.000 Ниво II | Boise, ID | 23. 4. 2025. | 1. 10. 2025. | Сертификовано |
| Principal Engineer, DRAM YE/YA | $168.500 Ниво II | Boise, ID | 11. 4. 2025. | 7. 9. 2025. | Сертификовано |
| Operation Improvement Engineer | $106.529 Ниво II | Boise, ID | 4. 4. 2025. | 28. 4. 2025. | Сертификовано |
| Metrology Applications Engineer | $147.000 Ниво III | Boise, ID | 1. 4. 2025. | 21. 4. 2025. | Сертификовано |
| Yield Analysis Manager | $160.430 Ниво II | Boise, ID | 20. 3. 2025. | 1. 4. 2025. | Сертификовано |
| Engineer-Difi Process | $104.974 Ниво II | Boise, ID | 20. 2. 2025. | 22. 8. 2025. | Сертификовано |
| Ram Engineer - Id1 | $101.000 Ниво I | Boise, ID | 10. 2. 2025. | 3. 3. 2025. | Сертификовано |
| Senior Manager Central Probe Planning | $148.501 Ниво III | Boise, ID | 28. 1. 2025. | 4. 2. 2025. | Сертификовано |
| Senior Manager Central Probe Planning | $148.501 Ниво III | Boise, ID | 9. 1. 2025. | 4. 2. 2025. | Сертификовано |
Prikazano 100 najnovijih od 131 prijava.
Plate su donja graneta ponuđene zarade po svakoj prijavi, preračunata na godišnji nivo; statistika koristi samo sertifikovane prijave za puno radno vreme. LCA nije odobrenje vize i jedna LCA može pokrivati više pozicija. Izvor: Američki ministarstvo rada, OFLC LCA podaci o otkrivanju, fiskalne godine 2023–2026 (najnovija odluka 30. 6. 2026.).