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Senior Packaging Engineer u Qualcomm Technologies, Inc.: H-1B plate
16 prijava za uslove rada za poziciju Senior Packaging Engineer u Qualcomm Technologies, Inc.. Medijana ponuđene osnovne plate $123.317; srednja polovina $115.500–$128.898.
Пријаве (LCA)16
Медијанска понуђена плата$123.317
Средина распона плата$115.500–$128.898
10.–90. перцентил$115.500–$128.898
По фискалним годинама
| Фискална година | LCA | Медијална плата |
|---|---|---|
| ФГ2023 | 3 | $115.500 |
| ФГ2024 | 4 | $115.500 |
| ФГ2025 | 4 | $127.200 |
| ФГ2026 | 5 | $128.898 |
Пријаве
| Основна плата | Локација | Послато | Датум почетка | Статус |
|---|---|---|---|---|
| $127.200–$190.800 Ниво II | Irvine, CA | 27. 4. 2026. | 29. 4. 2026. | Сертификовано |
| $128.898–$190.800 Ниво II | San Diego, CA | 16. 3. 2026. | 25. 8. 2026. | Сертификовано |
| $128.898–$190.800 Ниво II | San Diego, CA | 12. 1. 2026. | 25. 6. 2026. | Сертификовано |
| $128.898–$190.800 Ниво II | San Diego, CA | 11. 12. 2025. | 1. 5. 2026. | Сертификовано |
| $128.898–$190.800 Ниво II | San Diego, CA | 14. 11. 2025. | 15. 11. 2025. | Сертификовано |
| $156.853–$209.200 Ниво II | Santa Clara, CA | 13. 8. 2025. | 13. 8. 2025. | Сертификовано |
| $127.200–$190.800 Ниво II | Austin, TX | 13. 8. 2025. | 13. 1. 2026. | Сертификовано |
| $127.200–$190.800 Ниво II | San Diego, CA | 4. 3. 2025. | 2. 9. 2025. | Сертификовано |
| $119.434–$173.500 Ниво II | San Diego, CA | 16. 1. 2025. | 12. 7. 2025. | Сертификовано |
| $115.500–$173.500 Ниво II | San Diego, CA | 19. 3. 2024. | 7. 7. 2024. | Сертификовано |
| $115.500–$173.500 Ниво II | San Diego, CA | 12. 3. 2024. | 7. 7. 2024. | Сертификовано |
| $115.500–$173.500 Ниво II | San Diego, CA | 20. 11. 2023. | 10. 5. 2024. | Сертификовано |
| $115.500–$173.500 Ниво II | San Diego, CA | 1. 11. 2023. | 2. 11. 2023. | Сертификовано |
| $115.500–$173.500 Ниво II | Arcadia, CA | 24. 1. 2023. | 13. 7. 2023. | Сертификовано |
| $115.500–$173.500 Ниво II | Austin, TX | 23. 1. 2023. | 13. 7. 2023. | Сертификовано |
| $115.500–$173.500 Ниво II | San Diego, CA | 23. 1. 2023. | 13. 7. 2023. | Сертификовано |
Senior Packaging Engineer kod svih poslodavaca →
Ostali poslovi u Qualcomm Technologies, Inc.
- Senior ASICS Engineer$112.882
- Senior Software Engineer$121.597
- ASICS Engineer$109.470
- Software Engineer$111.322
- Staff ASICS Engineer$136.282
- Senior Cellular System Test Engineer$121.597
- Senior CPU Engineer$133.000
- Cellular System Test Engineer$104.290
- Staff Software Engineer$146.328
- Senior Modem Technologies Engineer$119.500
- Senior GPU Engineer$133.600
- Staff CPU Engineer$152.506
- Senior Staff ASICS Engineer$159.702
- Senior Camera Engineer$119.434
- Senior Machine Learning Engineer$133.000
- Staff GPU Engineer$151.000
- Senior Staff CPU Engineer$179.000
- GPU Engineer$116.843
- Senior Hardware Engineer$112.882
- Staff Cellular System Test Engineer$146.328
- Staff Modem Technologies Software Engineer$146.328
- Senior Modem Technologies Software Engineer$121.597
- Camera Engineer$112.882
- Senior Cellular Technologies Engineer$114.500
Plate su donja graneta ponuđene zarade po svakoj prijavi, preračunata na godišnji nivo; statistika koristi samo sertifikovane prijave za puno radno vreme. LCA nije odobrenje vize i jedna LCA može pokrivati više pozicija. Izvor: Američki ministarstvo rada, OFLC LCA podaci o otkrivanju, fiskalne godine 2023–2026 (najnovija odluka 30. 6. 2026.).