Lintlha tsa Moputso oa H1B

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Lead Software Engineering: Meputso ea H-1B

Likopo tsa maemo a mosebetsi tse 215 li sebelisitse sehlooho sa mosebetsi Lead Software Engineering. Moputso o fanoeng oa karolelano ke $160,466; halofo e bohareng $155,150–$169,855.

Likopo (LCAs)215
Moputso o mahareng o fanoeng$160,466
Karolo e bohareng ea meputso$155,150–$169,855
10th–90th percentile$145,000–$179,379

Molekane wa ho fihlela, mohiri kapa mmohi? Beha tshebeletso ya hao holimo leqepheng lena — $99 bakeng sa matsatsi a 30 →

Bahiri

Ka boemo ba moputso

Boemo ba moputsoMoputso oa mahareng
Boemo I (qalo)$120,723
Boemo II (bohlale)$160,000
Boemo III (boiphihlelo)$159,490
Boemo IV (bokhoni bo felletseng)$160,523

Lefapha la Mosebetsi le beha maemo a mane a moputso o tlwaelehileng bakeng sa tsebeletso ka nngwe le sebaka, ho tloha Level I (ho qala) ho ya Level IV (bokgoni bo felletseng). Mmohi o khetha boemo bo lumellanang le ditlhoko tsa mosebetsi.

Ka selemo sa lichelete

Selemo sa licheleteLi-LCAMoputso oa mahareng
FY20234$233,750
FY202455$160,000
FY202574$160,188
FY202680$164,458

Litoropo

Mekholo ke karolo e tlase ya moputso o fanoeng kopo ka nngwe, e fetolelwa ho palo ya selemo; dipalo-palo di sebedisa dikopo tse netefaditsweng tsa nako e felletseng feela. LCA ha se tumello ya visa, mme LCA e le nngwe e ka akaretsa maemo a mangata. Mohlodi: Lefapha la Mosebetsi la U.S., Data ya Phatlalatso ya OFLC LCA, dilemo tsa mahlakoreng 2023–2026 (qeto ya morao-rao Jun 30, 2026).