Etusivu › Työnantajat › Micron Idaho Semiconductor Manufacturing (Triton) LLC
Micron Idaho Semiconductor Manufacturing (Triton) LLC: H-1B-palkat ja sponsorointi
Micron Idaho Semiconductor Manufacturing (Triton) LLC jätti 131 työehtohakemusta H-1B- ja liittyville viisumeille tilivuosina 2023–2026; sertifioitu: 130. Tarjotun palkan mediaani: $111 118.
Hakemukset (LCA)131
Vahvistettu130
Työnantajan osoiteBoise, ID
H-1B-riippuvainen työnantajaEi
Tarjotun palkan mediaani$111 118
Palkkojen keskiosa$99 005–$126 970
10.–90. persentiili$95 000–$149 875
Sponsoroi Micron Idaho Semiconductor Manufacturing (Triton) LLC H-1B-viisumeja?
Micron Idaho Semiconductor Manufacturing (Triton) LLC jätti 131 työehtohakemusta tilivuosina 2023–2026, viimeisin jätetty 17.6.2026. LCA on H-1B-hakemuksen ensimmäinen vaihe, joten työnantaja on sponsoroinut tai valmistautunut sponsoroimaan H-1B-työntekijöitä; se ei takaa sponsorointia millekään tietylle tehtävälle. Tarkista työnantajan omat työpaikkailmoitukset.
Palkat tehtävänimen mukaan
| Tehtävänimike | LCA:t | Mediaanipalkka |
|---|---|---|
| Semiconductor Process Engineer | 23 | $106 093 |
| Equipment Engineer | 7 | $107 000 |
| Semiconductor Facilities Engineer | 5 | $110 000 |
| Operations Improvement Engineer | 4 | $105 923 |
| Senior Semiconductor Process Engineer | 4 | $140 000 |
| Manufacturing Engineer | 3 | $96 000 |
| CMP Senior Process Engineer | 3 | $121 125 |
| ID1 Sr Program Manager | 2 | $126 640 |
| FE US Expansion Planning Engineer | 2 | $87 199 |
| Process Engineer | 2 | $109 062 |
| Senior Manager Central Probe Planning | 2 | $148 501 |
| Principal Engineer, DRAM YE/YA | 2 | $168 500 |
| Semiconductor Manufacturing Process Engineer | 2 | $94 600 |
| ATE Process Engineer | 2 | $96 000 |
| Operation Improvement Engineer | 2 | $113 564 |
| Process Integration Engineer | 2 | $111 252 |
| Sr Engineer, Process Integration | 2 | $125 000 |
| Oi Scheduling Manager | 2 | $180 747 |
| Sr. Engineer, ID1 RAM RDA APPLICATIONS | 2 | $115 891 |
| Engineer, Id1 Me - FS Equipment | 2 | $102 752 |
| Surface Scientist (Semiconductor Process Engineer 3) | 1 | $120 000 |
| Manager, FE US Expansion Planning Probe | 1 | $124 432 |
| FE US Expansion Planning Strategy Engineer | 1 | $95 000 |
| 1D1 Senior Program Manager | 1 | $135 000 |
| Id1 Senior Program Manager | 1 | $135 000 |
| CMP Process Engineer | 1 | $93 000 |
| ENGINEER - OI (Software Development Engineer 2) | 1 | $95 000 |
| Senior Process Safety Engineer | 1 | $101 000 |
| Process Safety Engineer (Semiconductor Process Engineer 2) | 1 | $90 000 |
| Facilities Capital Planner Engineer 2 | 1 | $86 500 |
| WorkForce Development Specialist | 1 | $106 575 |
| Yield Analysis Manager | 1 | $160 430 |
| Engineer-Difi Process | 1 | $104 974 |
| Ram Engineer - Id1 | 1 | $101 000 |
| Real-Time Defect Analysis Engineer | 1 | $125 000 |
| Lead Principal Engineer, Process Quality | 1 | $170 000 |
| Facilties Operations Controls Engineer | 1 | $120 000 |
| Wet Process Equipment Engineer | 1 | $92 700 |
| US Expansion Planning Engineer | 1 | $92 866 |
| Expansion Planning Engineer | 1 | $100 500 |
Hakemukset tilivuosittain
| Tilikausi | LCA:t | Mediaanipalkka |
|---|---|---|
| Tilikausi 2023 | 2 | $126 640 |
| Tilikausi 2024 | 23 | $106 575 |
| Tilikausi 2025 | 41 | $108 750 |
| Tilikausi 2026 | 65 | $115 000 |
Yleiset palkkatasot
Työministeriö määrittää neljä yleistä palkkatasoa kullekin ammatille ja alueelle, tasolta I (sisäänpääsy) tasolle IV (täysin pätevä). Työnantaja valitsee tasoa, joka vastaa tehtävän vaatimuksia.
Missä tehtävät sijaitsevat
Ammatit
- Industrial Engineers43
- Materials Engineers29
- Chemical Engineers13
- Mechanical Engineers13
- Architectural and Engineering Managers10
- Electrical Engineers7
- Electronics Engineers, Except Computer7
- Civil Engineers2
- Software Developers2
- Logisticians1
Viimeisimmät hakemukset
| Tehtävänimike | Peruspalkka | Sijainti | Jätetty | Alkamispäivä | Tila |
|---|---|---|---|---|---|
| Semiconductor Process Engineer | $100 298 Taso II | Boise, ID | 17.6.2026 | 1.10.2026 | Vahvistettu |
| Senior Engineer - Manufacturing Engineering Planning | $115 000 Taso II | Boise, ID | 16.6.2026 | 20.7.2026 | Vahvistettu |
| Semiconductor Process Engineer | $120 000 Taso II | Boise, ID | 12.6.2026 | 29.6.2026 | Vahvistettu |
| Sr Engineer, US Expansion Planning | $113 500 Taso II | Boise, ID | 11.6.2026 | 29.6.2026 | Vahvistettu |
| Senior Semiconductor Process Engineer | $149 408 Taso IV | Boise, ID | 3.6.2026 | 17.11.2026 | Vahvistettu |
| Senior Equipment Engineer | $122 000 Taso II | Boise, ID | 19.5.2026 | 13.7.2026 | Vahvistettu |
| HVM Project Engineer | $113 997 | Boise, ID | 14.5.2026 | 1.10.2026 | Vahvistettu |
| Software Development Engineer | $97 850 Taso I | Boise, ID | 14.5.2026 | 14.6.2026 | Vahvistettu |
| Equipment Engineer | $97 757 Taso II | Boise, ID | 14.5.2026 | 1.10.2026 | Vahvistettu |
| Semiconductor Process Engineer | $98 919 | Boise, ID | 13.5.2026 | 1.10.2026 | Vahvistettu |
| Process Engineer | $108 124 Taso II | Boise, ID | 11.5.2026 | 1.10.2026 | Vahvistettu |
| Semiconductor Process Engineer | $120 000 Taso II | Boise, ID | 11.5.2026 | 1.10.2026 | Vahvistettu |
| Engineer, Process Integration | $97 531 Taso I | Boise, ID | 7.5.2026 | 1.10.2026 | Vahvistettu |
| Sr Engineer, Process Integration | $120 000 Taso III | Boise, ID | 6.5.2026 | 1.10.2026 | Vahvistettu |
| Semiconductor Process Engineer | $98 688 Taso II | Boise, ID | 6.5.2026 | 17.5.2026 | Vahvistettu |
| Engineer, Id1 Me - FS Equipment | $102 752 Taso I | Boise, ID | 5.5.2026 | 1.10.2026 | Vahvistettu |
| Manager, Quality & Deviation Management | $148 500 Taso II | Boise, ID | 5.5.2026 | 1.10.2026 | Vahvistettu |
| Oi Scheduling Manager | $180 747 Taso II | Boise, ID | 4.5.2026 | 24.5.2026 | Vahvistettu |
| Process Control Engineer | $98 000 Taso I | Boise, ID | 4.5.2026 | 1.10.2026 | Vahvistettu |
| Senior Manager, Id1 Manufacturing Engineering | $160 666 Taso II | Boise, ID | 4.5.2026 | 1.10.2026 | Vahvistettu |
| Senior Wet Etch Equipment Engineer | $109 000 Taso I | Boise, ID | 29.4.2026 | 1.10.2026 | Vahvistettu |
| Photo Equipment Engineer | $104 312 Taso II | Boise, ID | 29.4.2026 | 1.10.2026 | Vahvistettu |
| DRAM Failure Analysis Engineer | $112 793 Taso II | Boise, ID | 29.4.2026 | 1.10.2026 | Vahvistettu |
| ID1 Yield Analysis Engineer | $99 486 Taso II | Boise, ID | 29.4.2026 | 1.10.2026 | Vahvistettu |
| Semiconductor Process Engineer | $120 000 Taso IV | Boise, ID | 28.4.2026 | 1.10.2026 | Vahvistettu |
| Senior Engineer, Process Integration | $123 500 Taso III | Boise, ID | 27.4.2026 | 1.10.2026 | Vahvistettu |
| Operations Improvement Engineer | $106 698 Taso II | Boise, ID | 27.4.2026 | 1.10.2026 | Vahvistettu |
| Engineer, Id1 Me - FS Equipment | $102 752 Taso II | Boise, ID | 27.4.2026 | 1.10.2026 | Vahvistettu |
| Sr. Engineer, ID1 RAM RDA APPLICATIONS | $120 000 Taso II | Boise, ID | 27.4.2026 | 1.10.2026 | Vahvistettu |
| CMP Senior Process Engineer | $128 393 H-1B1 (Singapore) · Taso II | Boise, ID | 22.4.2026 | 7.9.2026 | Vahvistettu |
| Staff Engineer, US Expansion Strategic Planning | $136 460 Taso III | Boise, ID | 21.4.2026 | 24.5.2026 | Vahvistettu |
| CMP Staff Process Engineer | $128 393 Taso IV | Boise, ID | 21.4.2026 | 1.10.2026 | Vahvistettu |
| Operations Improvement Engineer | $105 148 Taso II | Boise, ID | 21.4.2026 | 1.10.2026 | Vahvistettu |
| Equipment Engineer | $97 799 Taso I | Boise, ID | 21.4.2026 | 1.10.2026 | Vahvistettu |
| Semiconductor Process Engineer | $100 298 Taso II | Boise, ID | 21.4.2026 | 1.10.2026 | Vahvistettu |
| Sr. Engineer, ID1 RAM RDA APPLICATIONS | $111 782 Taso II | Boise, ID | 21.4.2026 | 1.10.2026 | Vahvistettu |
| Oi Scheduling Manager | $180 747 Taso IV | Boise, ID | 17.4.2026 | 24.5.2026 | Vahvistettu |
| Operations Improvement Engineer | $107 000 Taso II | Boise, ID | 15.4.2026 | 1.10.2026 | Vahvistettu |
| Semiconductor Process Engineer | $83 000 Taso I | Boise, ID | 9.4.2026 | 1.10.2026 | Vahvistettu |
| Semiconductor Process Engineer | $106 093 Taso III | Boise, ID | 7.4.2026 | 20.4.2026 | Vahvistettu |
| Sr Engineer, Id1 Ate De Process | $110 000 Taso IV | Boise, ID | 1.4.2026 | 18.5.2026 | Vahvistettu |
| Lead Principal Engineer, Id1 Ate CMP Process | $164 052 Taso II | Boise, ID | 25.3.2026 | 20.4.2026 | Vahvistettu |
| Equipment Engineer | $115 000 Taso II | Boise, ID | 25.3.2026 | 20.4.2026 | Vahvistettu |
| Senior Engineer, ID1 PEE PCVD Process | $120 000 Taso II | Boise, ID | 19.3.2026 | 6.4.2026 | Vahvistettu |
| Staff Engineer, Id1 Pee - PH Equipment | $127 080 Taso III | Boise, ID | 11.3.2026 | 10.9.2026 | Vahvistettu |
| Sr Engineer, Process Integration | $130 000 Taso II | Boise, ID | 10.3.2026 | 6.4.2026 | Vahvistettu |
| Facilities Capacity Planning Engineer | $100 707 Taso I | Boise, ID | 10.3.2026 | 10.8.2026 | Vahvistettu |
| Equipment Engineer | $140 000 Taso III | Boise, ID | 10.3.2026 | 20.4.2026 | Vahvistettu |
| Wet Etch Staff Process Engineer | $154 080 Taso II | Boise, ID | 20.2.2026 | 6.4.2026 | Vahvistettu |
| Photolithography Process Engineer | $95 000 Taso II | Boise, ID | 18.2.2026 | 10.8.2026 | Vahvistettu |
| Semiconductor Process Engineer | $128 000 Taso III | Boise, ID | 18.2.2026 | 16.3.2026 | Vahvistettu |
| Principal Engineer Oct Adt Pee -Dry Etch | $169 906 Taso IV | Boise, ID | 18.2.2026 | 31.5.2026 | Vahvistettu |
| Sr. Engineer, ID1 PEE PCVD Equipment | $130 000 H-1B1 (Singapore) · Taso IV | Boise, ID | 17.2.2026 | 1.6.2026 | Vahvistettu |
| Semiconductor Process Engineer | $85 075 Taso I | Boise, ID | 10.2.2026 | 3.8.2026 | Vahvistettu |
| Semiconductor Process Engineer | $110 000 Taso II | Boise, ID | 10.2.2026 | 3.8.2026 | Vahvistettu |
| Sr Engineer, ID1 Yield Analysis | $128 000 Taso II | Boise, ID | 10.2.2026 | 16.3.2026 | Vahvistettu |
| Sr. Semiconductor Process Engineer | $115 000 Taso II | Boise, ID | 29.1.2026 | 17.2.2026 | Vahvistettu |
| Semiconductor Facilities Engineer | $120 000 Taso II | Boise, ID | 28.1.2026 | 2.2.2026 | Vahvistettu |
| Semiconductor Manufacturing Process Engineer | $96 500 Taso II | Boise, ID | 6.1.2026 | 1.2.2026 | Vahvistettu |
| Principal ID1 Program Manager | $158 601 Taso III | Austin, TX | 30.12.2025 | 19.6.2026 | Vahvistettu |
| Operation Improvement Engineer | $120 599 Taso II | San Jose, CA | 29.12.2025 | 5.1.2026 | Vahvistettu |
| Staff Engineer, Id1 Pee PH Process | $140 000 Taso III | Boise, ID | 19.12.2025 | 5.1.2026 | Vahvistettu |
| SR. Engineer, Change Management | $112 950 Taso III | Boise, ID | 12.12.2025 | 5.1.2026 | Vahvistettu |
| Equipment Engineer | $103 000 Taso II | Boise, ID | 8.12.2025 | 5.1.2026 | Vahvistettu |
| Sr Engineer, F4 IE Layout | $115 000 Taso II | Boise, ID | 18.11.2025 | 5.1.2026 | Vahvistettu |
| Reticle Coordinator Engineer | $139 940 Taso IV | Boise, ID | 23.9.2025 | 25.3.2026 | Vahvistettu |
| Engineer, RAM Hardware ID1 | $98 000 Taso I | Boise, ID | 23.9.2025 | 17.11.2025 | Vahvistettu |
| Process Integration Engingeer | $110 984 Taso II | Boise, ID | 12.9.2025 | 18.9.2025 | Vahvistettu |
| Equipment Engineer | $165 000 Taso IV | Boise, ID | 5.9.2025 | 6.10.2025 | Vahvistettu |
| Process Integration Engineer | $111 252 Taso II | Boise, ID | 11.8.2025 | 5.10.2025 | Vahvistettu |
| Process Integration Engineer | $111 252 Taso II | Boise, ID | 31.7.2025 | 5.10.2025 | Peruutettu |
| CMP Senior Process Engineer | $121 125 H-1B1 (Singapore) · Taso III | Boise, ID | 10.7.2025 | 9.12.2025 | Vahvistettu |
| Lead Principal Engineer, Process Quality | $170 000 Taso III | Boise, ID | 23.6.2025 | 31.8.2025 | Vahvistettu |
| Facilties Operations Controls Engineer | $120 000 Taso II | Boise, ID | 20.6.2025 | 21.7.2025 | Vahvistettu |
| Semiconductor Process Engineer | $110 000 Taso II | Boise, ID | 16.6.2025 | 1.10.2025 | Vahvistettu |
| Semiconductor Process Engineer | $95 000 Taso II | Boise, ID | 11.6.2025 | 1.10.2025 | Vahvistettu |
| Wet Process Equipment Engineer | $92 700 Taso II | Boise, ID | 10.6.2025 | 1.10.2025 | Vahvistettu |
| Semiconductor Facilities Engineer | $98 272 Taso III | Boise, ID | 30.5.2025 | 1.10.2025 | Vahvistettu |
| Semiconductor Process Engineer | $96 000 Taso I | Boise, ID | 27.5.2025 | 1.10.2025 | Vahvistettu |
| US Expansion Planning Engineer | $92 866 Taso II | Boise, ID | 27.5.2025 | 1.10.2025 | Vahvistettu |
| Semiconductor Process Engineer | $105 410 Taso I | Boise, ID | 12.5.2025 | 1.10.2025 | Vahvistettu |
| Expansion Planning Engineer | $100 500 Taso II | Boise, ID | 9.5.2025 | 1.10.2025 | Vahvistettu |
| Semiconductor Process Engineer | $107 500 Taso II | Boise, ID | 8.5.2025 | 1.10.2025 | Vahvistettu |
| Equipment Engineer | $107 000 Taso III | Boise, ID | 8.5.2025 | 1.10.2025 | Vahvistettu |
| Principal Engineer, DRAM YE/YA | $168 500 Taso II | Boise, ID | 8.5.2025 | 7.9.2025 | Vahvistettu |
| Director, ATE Photolithography “ ID1 | $218 800 Taso IV | Boise, ID | 7.5.2025 | 1.10.2025 | Vahvistettu |
| Semiconductor Facilities Engineer | $98 000 Taso II | Boise, ID | 6.5.2025 | 1.10.2025 | Vahvistettu |
| Semiconductor Manufacturing Process Engineer | $92 700 Taso II | Boise, ID | 29.4.2025 | 1.10.2025 | Vahvistettu |
| Senior Semiconductor Process Engineer | $96 000 Taso I | Boise, ID | 29.4.2025 | 1.10.2025 | Vahvistettu |
| ATE Process Engineer | $96 000 Taso II | Boise, ID | 24.4.2025 | 1.10.2025 | Vahvistettu |
| ATE Process Engineer | $96 000 Taso I | Boise, ID | 24.4.2025 | 1.10.2025 | Vahvistettu |
| Manufacturing Engineer | $96 000 Taso II | Boise, ID | 23.4.2025 | 1.10.2025 | Vahvistettu |
| Principal Engineer, DRAM YE/YA | $168 500 Taso II | Boise, ID | 11.4.2025 | 7.9.2025 | Vahvistettu |
| Operation Improvement Engineer | $106 529 Taso II | Boise, ID | 4.4.2025 | 28.4.2025 | Vahvistettu |
| Metrology Applications Engineer | $147 000 Taso III | Boise, ID | 1.4.2025 | 21.4.2025 | Vahvistettu |
| Yield Analysis Manager | $160 430 Taso II | Boise, ID | 20.3.2025 | 1.4.2025 | Vahvistettu |
| Engineer-Difi Process | $104 974 Taso II | Boise, ID | 20.2.2025 | 22.8.2025 | Vahvistettu |
| Ram Engineer - Id1 | $101 000 Taso I | Boise, ID | 10.2.2025 | 3.3.2025 | Vahvistettu |
| Senior Manager Central Probe Planning | $148 501 Taso III | Boise, ID | 28.1.2025 | 4.2.2025 | Vahvistettu |
| Senior Manager Central Probe Planning | $148 501 Taso III | Boise, ID | 9.1.2025 | 4.2.2025 | Vahvistettu |
Näytetään 131 hakemuksesta 100 viimeisintä.
Palkat ovat hakemuksessa tarjotun palkan alarajaa, muunnettuna vuosituksi; tilastoissa käytetään vain sertifioituja kokoaikaisia hakemuksia. LCA ei ole viisumipäätös, ja yksi LCA voi kattaa useita tehtäviä. Lähde: Yhdysvaltain työministeriö, OFLC LCA -tilastot, tilivuodet 2023–2026 (viimeisin päätös 30.6.2026).