Done sou Salè H1B

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Software Firmware Engineer 3 nan HP Inc.: Salè H-1B

7 aplikasyon kondisyon travay pou tit travay Software Firmware Engineer 3 nan HP Inc.. Salè baz medyàn ofri $117,915; mwatye mitan $113,412–$133,588.

Demann (LCA)7
Salè medyan ofri$117,915
Mwatye salè yo$113,412–$133,588
10yèm–90yèm pousantaj$107,253–$145,650

Pa ane fiskal

Ane fiskalLCASalè medyan
FY20231$155,397
FY20241$117,915
FY20251$112,070
FY20264$121,389

Aplikasyon

Salè bazKoteSoumètDat kòmansmanEstati
$128,024–$155,000
Nivo III
Boise, IDJun 17, 2026Aug 14, 2026Certifye
$114,754–$185,000
Nivo II
Austin, TXMay 26, 2026Oct 1, 2026Certifye
$139,152–$185,000
Nivo III
Austin, TXMar 2, 2026Aug 28, 2026Certifye
$100,027–$155,000
Nivo II
Boise, IDFeb 20, 2026Aug 14, 2026Certifye
$112,070–$142,384
Nivo II
Vancouver, WAJan 9, 2025Jun 16, 2025Certifye
$117,915–$137,915
Nivo IV
Fort Collins, COApr 11, 2024Oct 1, 2024Certifye
$155,397
Nivo IV
San Diego, CAMar 31, 2023Sep 10, 2023Certifye

Lòt travay nan HP Inc.

Salè yo se fen ki pi ba nan salè yo ofri sou chak aplikasyon, konvèti nan yon montan anyèl; estatistik yo itilize sèlman aplikasyon tan plen sètifye. Yon LCA pa yon apwobasyon visa epi yon sèl LCA ka kouvri plizyè pozisyon. Sous: Depatman Travay Etazini, Done Divulgasyon LCA OFLC, ane fiskal 2023–2026 (dènye desizyon Jun 30, 2026).