Done sou Salè H1B

Akèy › Anplwayè › Sandisk Technologies, Inc. › Principal Engineer, Packaging Engineering

Principal Engineer, Packaging Engineering nan Sandisk Technologies, Inc.: Salè H-1B

10 aplikasyon kondisyon travay pou tit travay Principal Engineer, Packaging Engineering nan Sandisk Technologies, Inc.. Salè baz medyàn ofri $170,248; mwatye mitan $170,248–$176,509.

Demann (LCA)10
Salè medyan ofri$170,248
Mwatye salè yo$170,248–$176,509
10yèm–90yèm pousantaj$158,995–$185,869

Pa ane fiskal

Ane fiskalLCASalè medyan
FY20254$178,058
FY20266$170,248

Aplikasyon

Salè bazKoteSoumètDat kòmansmanEstati
$158,995–$178,848
Nivo III
San Jose, CAMar 27, 2026Sep 26, 2026Certifye
$158,995–$178,848
Nivo III
Milpitas, CAMar 27, 2026Sep 26, 2026Certifye
$176,509–$178,848San Jose, CAMar 17, 2026Aug 1, 2026Certifye
$176,509–$178,848Milpitas, CAMar 17, 2026Aug 1, 2026Certifye
$170,248–$178,848
Nivo IV
Fremont, CAMar 16, 2026Aug 23, 2026Certifye
$170,248–$178,848
Nivo IV
Milpitas, CAMar 9, 2026Aug 23, 2026Certifye
$170,248–$172,800
Nivo IV
San Jose, CAAug 8, 2025Sep 15, 2025Certifye
$170,248–$172,800
Nivo IV
Milpitas, CAAug 8, 2025Sep 15, 2025Certifye
$185,869–$195,700
Nivo IV
Milpitas, CAJul 17, 2025Aug 4, 2025Certifye
$185,869–$195,700
Nivo IV
Milpitas, CAJul 17, 2025Aug 4, 2025Certifye

Lòt travay nan Sandisk Technologies, Inc.

Salè yo se fen ki pi ba nan salè yo ofri sou chak aplikasyon, konvèti nan yon montan anyèl; estatistik yo itilize sèlman aplikasyon tan plen sètifye. Yon LCA pa yon apwobasyon visa epi yon sèl LCA ka kouvri plizyè pozisyon. Sous: Depatman Travay Etazini, Done Divulgasyon LCA OFLC, ane fiskal 2023–2026 (dènye desizyon Jun 30, 2026).