Done sou Salè H1B

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Staff Engineer, Packaging Engineering nan Sandisk Technologies, Inc.: Salè H-1B

6 aplikasyon kondisyon travay pou tit travay Staff Engineer, Packaging Engineering nan Sandisk Technologies, Inc.. Salè baz medyàn ofri $148,655; mwatye mitan $148,655–$155,043.

Demann (LCA)6
Salè medyan ofri$148,655
Mwatye salè yo$148,655–$155,043
10yèm–90yèm pousantaj$144,357–$155,043

Pa ane fiskal

Ane fiskalLCASalè medyan
FY20253$155,043
FY20262$148,655

Aplikasyon

Salè bazKoteSoumètDat kòmansmanEstati
$148,655–$171,914Milpitas, CAMar 27, 2026Sep 26, 2026Certifye
$148,655–$171,914Milpitas, CAMar 27, 2026Sep 26, 2026Certifye
$155,043–$164,800
Nivo III
San Jose, CAMay 28, 2025Oct 1, 2025Certifye
$155,043–$164,800
Nivo III
Milpitas, CAMay 28, 2025Oct 1, 2025Certifye
$141,491–$154,065
tan pasyèl
Milpitas, CAMar 24, 2025Sep 16, 2025Certifye
$141,491–$154,065San Jose, CAMar 24, 2025Sep 16, 2025Certifye

Lòt travay nan Sandisk Technologies, Inc.

Salè yo se fen ki pi ba nan salè yo ofri sou chak aplikasyon, konvèti nan yon montan anyèl; estatistik yo itilize sèlman aplikasyon tan plen sètifye. Yon LCA pa yon apwobasyon visa epi yon sèl LCA ka kouvri plizyè pozisyon. Sous: Depatman Travay Etazini, Done Divulgasyon LCA OFLC, ane fiskal 2023–2026 (dènye desizyon Jun 30, 2026).