H1B Salary Data

Fuula Jalqabaa › Tajaajiltoota › Sandisk Technologies, Inc. › Principal Engineer, Packaging Engineering

Principal Engineer, Packaging Engineering at Sandisk Technologies, Inc.: H-1B salaries

10 labor condition applications for the job title Principal Engineer, Packaging Engineering at Sandisk Technologies, Inc.. Median offered base salary $170,248; middle half $170,248–$176,509.

Kaayyoo (LCAs)10
Gatii tajaajilaa giddu-galeessa$170,248
Harka gidduu gatiiwwan$170,248–$176,509
Sadarkaa 10ffaa–90ffaa$158,995–$185,869

Akka waggaa maallaqaaatti

Bara maallaqaaLCAsBaasii giddu-galeessaa
FY20254$178,058
FY20266$170,248

Applications

Baasii bu'uuraaBakkaDhiyaateGuyyaa jalqabaaHaala
$158,995–$178,848
Sadarkaa III
San Jose, CA27-Bit-202626-Ful-2026Mirkaneffame
$158,995–$178,848
Sadarkaa III
Milpitas, CA27-Bit-202626-Ful-2026Mirkaneffame
$176,509–$178,848San Jose, CA17-Bit-202601-Hag-2026Mirkaneffame
$176,509–$178,848Milpitas, CA17-Bit-202601-Hag-2026Mirkaneffame
$170,248–$178,848
Sadarkaa IV
Fremont, CA16-Bit-202623-Hag-2026Mirkaneffame
$170,248–$178,848
Sadarkaa IV
Milpitas, CA09-Bit-202623-Hag-2026Mirkaneffame
$170,248–$172,800
Sadarkaa IV
San Jose, CA08-Hag-202515-Ful-2025Mirkaneffame
$170,248–$172,800
Sadarkaa IV
Milpitas, CA08-Hag-202515-Ful-2025Mirkaneffame
$185,869–$195,700
Sadarkaa IV
Milpitas, CA17-Ado-202504-Hag-2025Mirkaneffame
$185,869–$195,700
Sadarkaa IV
Milpitas, CA17-Ado-202504-Hag-2025Mirkaneffame

Other jobs at Sandisk Technologies, Inc.

Baajanni gatii gadii gatii hojii iyyannoo tokkoo tokkoon irratti dhiyaate yoo ta'u, gara baajannaa waggaatti jijjiirame; lakkoofsa hojii guutuu hamma guyyaa guutuu qofa fayyadama. LCA mirkaneessa viizaa miti; LCA tokko hojii hedduu haguuchuuf ni danda'a. Madda: Dhaabbata Hojii Ameerikaa, OFLC LCA Disclosure Data, bara maallaqaa 2023–2026 (murtii haaraa 30-Wax-2026).