H1B Salary Data

Fuula Jalqabaa › Tajaajiltoota › Sandisk Technologies, Inc. › Staff Engineer, Packaging Engineering

Staff Engineer, Packaging Engineering at Sandisk Technologies, Inc.: H-1B salaries

6 labor condition applications for the job title Staff Engineer, Packaging Engineering at Sandisk Technologies, Inc.. Median offered base salary $148,655; middle half $148,655–$155,043.

Kaayyoo (LCAs)6
Gatii tajaajilaa giddu-galeessa$148,655
Harka gidduu gatiiwwan$148,655–$155,043
Sadarkaa 10ffaa–90ffaa$144,357–$155,043

Akka waggaa maallaqaaatti

Bara maallaqaaLCAsBaasii giddu-galeessaa
FY20253$155,043
FY20262$148,655

Applications

Baasii bu'uuraaBakkaDhiyaateGuyyaa jalqabaaHaala
$148,655–$171,914Milpitas, CA27-Bit-202626-Ful-2026Mirkaneffame
$148,655–$171,914Milpitas, CA27-Bit-202626-Ful-2026Mirkaneffame
$155,043–$164,800
Sadarkaa III
San Jose, CA28-Cam-202501-Onk-2025Mirkaneffame
$155,043–$164,800
Sadarkaa III
Milpitas, CA28-Cam-202501-Onk-2025Mirkaneffame
$141,491–$154,065
sa'aatii keessa
Milpitas, CA24-Bit-202516-Ful-2025Mirkaneffame
$141,491–$154,065San Jose, CA24-Bit-202516-Ful-2025Mirkaneffame

Other jobs at Sandisk Technologies, Inc.

Baajanni gatii gadii gatii hojii iyyannoo tokkoo tokkoon irratti dhiyaate yoo ta'u, gara baajannaa waggaatti jijjiirame; lakkoofsa hojii guutuu hamma guyyaa guutuu qofa fayyadama. LCA mirkaneessa viizaa miti; LCA tokko hojii hedduu haguuchuuf ni danda'a. Madda: Dhaabbata Hojii Ameerikaa, OFLC LCA Disclosure Data, bara maallaqaa 2023–2026 (murtii haaraa 30-Wax-2026).