H1B Salary Data

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Packaging R&D Engineer at Intel Corporation: H-1B salaries

5 labor condition applications for the job title Packaging R&D Engineer at Intel Corporation. Median offered base salary $179,650; middle half $177,200–$181,314.

Applications (LCAs)5
Median offered salary$179,650
Middle half of salaries$177,200–$181,314
10th–90th percentile$167,550–$187,729

By fiscal year

Fiscal yearLCAsMedian salary
FY20231$161,117
FY20241$179,650
FY20253$181,314

Applications

Base salaryLocationSubmittedStart dateStatus
$192,005–$241,880
Level III
Austin, TXJul 31, 2025Oct 1, 2025Certified
$181,314–$250,160
Level III
Round Rock, TXJun 3, 2025Oct 1, 2025Certified
$177,200–$250,160
Level III
Chandler, AZApr 23, 2025Oct 1, 2025Certified
$179,650–$221,610
Level IV
Chandler, AZMar 14, 2024Aug 28, 2024Certified
$161,117–$221,610
Level III
Chandler, AZMar 16, 2023Sep 8, 2023Certified

Other jobs at Intel Corporation

Salaries are the lower end of the wage offered on each application, converted to a yearly amount; statistics use certified full-time applications only. An LCA is not a visa approval and one LCA can cover several positions. Source: U.S. Department of Labor, OFLC LCA Disclosure Data, fiscal years 2023–2026 (latest decision Jun 30, 2026).