H1B Salary Data

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SMTS Packaging Engineer at Advanced Micro Devices, Inc.: H-1B salaries

5 labor condition applications for the job title SMTS Packaging Engineer at Advanced Micro Devices, Inc.. Median offered base salary $158,725; middle half $148,741–$185,000.

Applications (LCAs)5
Median offered salary$158,725
Middle half of salaries$148,741–$185,000
10th–90th percentile$120,137–$186,320

By fiscal year

Fiscal yearLCAsMedian salary
FY20231$187,200
FY20242$129,896
FY20251$185,000
FY20261$148,741

Applications

Base salaryLocationSubmittedStart dateStatus
$148,741–$230,100
Level IV		Austin, TXJan 30, 2026Jul 30, 2026Certified
$185,000
Level IV		Austin, TXOct 30, 2024Nov 6, 2024Certified, then withdrawn
$101,067–$219,960
Level IV		Lehi, UTMar 20, 2024Sep 14, 2024Certified
$158,725–$255,450
Level IV		Santa Clara, CAFeb 13, 2024Aug 9, 2024Certified
$187,200
Level IV		Santa Clara, CAApr 27, 2023Oct 1, 2023Certified

Other jobs at Advanced Micro Devices, Inc.

Salaries are the lower end of the wage offered on each application, converted to a yearly amount; statistics use certified full-time applications only. An LCA is not a visa approval and one LCA can cover several positions. Source: U.S. Department of Labor, OFLC LCA Disclosure Data, fiscal years 2023–2026 (latest decision Jun 30, 2026).