H1B Salary Data

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Software Application Developer (Lead Engineer) at Technosoft Corporation: H-1B salaries

6 labor condition applications for the job title Software Application Developer (Lead Engineer) at Technosoft Corporation. Median offered base salary $130,650; middle half $130,000–$140,075.

Applications (LCAs)6
Median offered salary$130,650
Middle half of salaries$130,000–$140,075
10th–90th percentile$128,500–$149,000

By fiscal year

Fiscal yearLCAsMedian salary
FY20233$130,000
FY20243$143,000

Applications

Base salaryLocationSubmittedStart dateStatus
$131,300–$165,000
Level IV
Salem, ORSep 6, 2024Sep 16, 2024Certified
$155,000–$185,000
Level IV
Salem, ORJul 26, 2024Aug 12, 2024Certified
$143,000–$175,000
Level IV
Cumming, GAJan 31, 2024Feb 19, 2024Certified
$130,000–$160,000
Level IV
Salem, ORJul 20, 2023Aug 7, 2023Certified
$130,000–$160,000
Level IV
Salem, ORJul 19, 2023Aug 7, 2023Certified
$127,000–$150,000
Level IV
Salem, ORJul 19, 2023Aug 7, 2023Certified

Other jobs at Technosoft Corporation

Salaries are the lower end of the wage offered on each application, converted to a yearly amount; statistics use certified full-time applications only. An LCA is not a visa approval and one LCA can cover several positions. Source: U.S. Department of Labor, OFLC LCA Disclosure Data, fiscal years 2023–2026 (latest decision Jun 30, 2026).