H1B Salary Data

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Staff Engineer, Packaging Engineering at Western Digital Technologies, Inc.: H-1B salaries

7 labor condition applications for the job title Staff Engineer, Packaging Engineering at Western Digital Technologies, Inc.. Median offered base salary $140,525; middle half $137,363–$141,762.

Applications (LCAs)7
Median offered salary$140,525
Middle half of salaries$137,363–$141,762
10th–90th percentile$131,381–$143,000

By fiscal year

Fiscal yearLCAsMedian salary
FY20233$137,363
FY20244$141,762

Applications

Base salaryLocationSubmittedStart dateStatus
$140,525–$150,000
Level III		San Jose, CAMar 12, 2024Sep 5, 2024Certified
$140,525–$150,000
Level III		Milpitas, CAMar 12, 2024Sep 5, 2024Certified
$143,000–$147,000
Level III		Sunnyvale, CAFeb 29, 2024Jul 28, 2024Certified
$143,000–$147,000
Level III		Milpitas, CAFeb 29, 2024Jul 29, 2024Certified
$122,408–$133,256
Level III		Milpitas, CAMay 31, 2023Aug 23, 2023Certified
$137,363–$147,000
Level III		Milpitas, CAMar 31, 2023Sep 29, 2023Certified
$137,363–$147,000
Level III		Milpitas, CAMar 31, 2023Sep 29, 2023Certified

Other jobs at Western Digital Technologies, Inc.

Salaries are the lower end of the wage offered on each application, converted to a yearly amount; statistics use certified full-time applications only. An LCA is not a visa approval and one LCA can cover several positions. Source: U.S. Department of Labor, OFLC LCA Disclosure Data, fiscal years 2023–2026 (latest decision Jun 30, 2026).