Beranda › Pemberi Kerja › Sandisk Technologies, Inc. › Principal Engineer, Packaging Engineering
Gaji H-1B untuk Principal Engineer, Packaging Engineering di Sandisk Technologies, Inc.
10 aplikasi kondisi tenaga kerja untuk jabatan Principal Engineer, Packaging Engineering di Sandisk Technologies, Inc.. Gaji pokok median yang ditawarkan $170.248; setengah tengah $170.248–$176.509.
Lamaran (LCA)10
Median gaji yang ditawarkan$170.248
Setengah bagian tengah gaji$170.248–$176.509
Persentil ke-10 hingga ke-90$158.995–$185.869
Berdasarkan Tahun Fiskal
| Tahun Fiskal | LCA | Median Gaji |
|---|---|---|
| FY2025 | 4 | $178.058 |
| FY2026 | 6 | $170.248 |
Aplikasi
| Gaji Pokok | Lokasi | Diajukan | Tanggal Mulai | Status |
|---|---|---|---|---|
| $158.995–$178.848 Level III | San Jose, CA | 27 Mar 2026 | 26 Sep 2026 | Tersertifikasi |
| $158.995–$178.848 Level III | Milpitas, CA | 27 Mar 2026 | 26 Sep 2026 | Tersertifikasi |
| $176.509–$178.848 | San Jose, CA | 17 Mar 2026 | 1 Agu 2026 | Tersertifikasi |
| $176.509–$178.848 | Milpitas, CA | 17 Mar 2026 | 1 Agu 2026 | Tersertifikasi |
| $170.248–$178.848 Level IV | Fremont, CA | 16 Mar 2026 | 23 Agu 2026 | Tersertifikasi |
| $170.248–$178.848 Level IV | Milpitas, CA | 9 Mar 2026 | 23 Agu 2026 | Tersertifikasi |
| $170.248–$172.800 Level IV | San Jose, CA | 8 Agu 2025 | 15 Sep 2025 | Tersertifikasi |
| $170.248–$172.800 Level IV | Milpitas, CA | 8 Agu 2025 | 15 Sep 2025 | Tersertifikasi |
| $185.869–$195.700 Level IV | Milpitas, CA | 17 Jul 2025 | 4 Agu 2025 | Tersertifikasi |
| $185.869–$195.700 Level IV | Milpitas, CA | 17 Jul 2025 | 4 Agu 2025 | Tersertifikasi |
Jabatan lain di Sandisk Technologies, Inc.
- Senior Engineer, Industrial Engineering$94.058
- Senior Engineer, VLSI Design Engineering$127.234
- Staff Engineer, Technology Development Engineering$144.664
- Principal Engineer, Product Development Engineering$178.006
- Senior Engineer, Software Development Engineering (Apps)$136.297
- Staff Engineer, VLSI Design Engineering$129.772
- Principal Engineer, VLSI Design Engineering$165.275
- Staff Engineer, Industrial Engineering$92.976
- Technologist, Firmware Engineering$198.248
- Senior Engineer, Systems Design Engineering$126.994
- Analyst 4, Business Applications$167.362
- Staff Engineer, Product Development Engineering$132.196
- Staff Engineer, Packaging Engineering$148.655
- Manager 2, Strategic Sourcing$92.976
- Technologist, VLSI Design Engineering$178.006
- Principal Engineer, Software Development Engineering (Apps)$213.512
- Scientist 3, Data Science$174.783
- Senior Engineer, Firmware Verification Engineering$94.162
- Professional 4, Information Technology$149.240
- Staff Engineer, Firmware Verification Engineering$129.792
- Staff Engineer, Software Development Engineering (Apps)$169.576
Gaji adalah batas bawah dari upah yang ditawarkan pada setiap aplikasi, dikonversi menjadi jumlah tahunan; statistik hanya menggunakan aplikasi penuh waktu yang tersertifikasi. LCA bukan persetujuan visa dan satu LCA dapat mencakup beberapa posisi. Sumber: Data Pengungkapan LCA OFLC, Departemen Tenaga Kerja AS, tahun fiskal 2023–2026 (keputusan terbaru 30 Jun 2026).