H1B Salary Data

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Staff Engineer, Packaging Engineering at Sandisk Technologies, Inc.: H-1B salaries

6 labor condition applications for the job title Staff Engineer, Packaging Engineering at Sandisk Technologies, Inc.. Median offered base salary $148,655; middle half $148,655–$155,043.

Applications (LCAs)6
Median offered salary$148,655
Middle half of salaries$148,655–$155,043
10th–90th percentile$144,357–$155,043

By fiscal year

Fiscal yearLCAsMedian salary
FY20253$155,043
FY20262$148,655

Applications

Base salaryLocationSubmittedStart dateStatus
$148,655–$171,914Milpitas, CAMar 27, 2026Sep 26, 2026Certified
$148,655–$171,914Milpitas, CAMar 27, 2026Sep 26, 2026Certified
$155,043–$164,800
Level III
San Jose, CAMay 28, 2025Oct 1, 2025Certified
$155,043–$164,800
Level III
Milpitas, CAMay 28, 2025Oct 1, 2025Certified
$141,491–$154,065
part-time
Milpitas, CAMar 24, 2025Sep 16, 2025Certified
$141,491–$154,065San Jose, CAMar 24, 2025Sep 16, 2025Certified

Other jobs at Sandisk Technologies, Inc.

Salaries are the lower end of the wage offered on each application, converted to a yearly amount; statistics use certified full-time applications only. An LCA is not a visa approval and one LCA can cover several positions. Source: U.S. Department of Labor, OFLC LCA Disclosure Data, fiscal years 2023–2026 (latest decision Jun 30, 2026).