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Electrical/Hardware Engineer di HP Inc.: Gaji H-1B
19 permohonan syarat buruh untuk jawatan Electrical/Hardware Engineer di HP Inc.. Gaji asas median yang ditawarkan $102,024; separuh tengah $95,752–$108,888.
Permohonan (LCA)19
Median gaji yang ditawarkan$102,024
Separuh tengah gaji$95,752–$108,888
Persentil ke-10 hingga ke-90$93,155–$124,051
Mengikut tahun fiskal
| Tahun fiskal | LCA | Gaji median |
|---|---|---|
| FY2023 | 9 | $96,387 |
| FY2024 | 10 | $108,888 |
Permohonan
| Gaji asas | Lokasi | Dihantar | Tarikh mula | Status |
|---|---|---|---|---|
| $123,115–$150,000 Tahap IV | San Diego, CA | 5 Jun 2024 | 30 Sep 2024 | Disahkan |
| $95,139–$120,000 Tahap II | Spring, TX | 23 Apr 2024 | 1 Okt 2024 | Disahkan |
| $105,331–$180,000 Tahap II | Scotts Valley, CA | 15 Apr 2024 | 1 Okt 2024 | Disahkan |
| $108,888–$128,888 Tahap III | Corvallis, OR | 15 Apr 2024 | 1 Okt 2024 | Disahkan |
| $108,888–$111,219 Tahap III | Corvallis, OR | 5 Apr 2024 | 20 Sep 2024 | Disahkan |
| $108,888–$125,290 Tahap III | Corvallis, OR | 21 Mac 2024 | 17 Sep 2024 | Disahkan |
| $124,051–$125,290 Tahap IV | Corvallis, OR | 16 Mac 2024 | 25 Ogo 2024 | Disahkan |
| $124,051–$125,500 Tahap IV | Corvallis, OR | 13 Mac 2024 | 6 Sep 2024 | Disahkan |
| $124,051–$129,162 Tahap IV | Corvallis, OR | 29 Feb 2024 | 25 Ogo 2024 | Disahkan |
| $93,725–$102,173 Tahap II | Corvallis, OR | 17 Jan 2024 | 29 Mac 2024 | Disahkan |
| $97,448–$110,000 Tahap IV | Corvallis, OR | 4 Ogo 2023 | 1 Okt 2023 | Disahkan |
| $90,875 Tahap II | Spring, TX | 16 Mac 2023 | 5 Sep 2023 | Disahkan |
| $86,923 Tahap II | Corvallis, OR | 16 Mac 2023 | 8 Ogo 2023 | Disahkan |
| $96,387–$125,290 Tahap IV | Corvallis, OR | 7 Mac 2023 | 23 Ogo 2023 | Disahkan |
| $94,910–$100,225 Tahap II | San Diego, CA | 27 Jan 2023 | 20 Jul 2023 | Disahkan |
| $102,024–$125,290 Tahap III | Corvallis, OR | 25 Jan 2023 | 20 Jul 2023 | Disahkan |
| $102,024–$110,000 Tahap III | Corvallis, OR | 23 Jan 2023 | 17 Jul 2023 | Disahkan |
| $102,024–$125,290 Tahap III | Corvallis, OR | 23 Jan 2023 | 13 Jul 2023 | Disahkan |
| $96,366 Tahap II | Santa Cruz, CA | 13 Jan 2023 | 11 Jul 2023 | Disahkan |
Jawatan lain di HP Inc.
- Software Applications Engineer$121,400
- Software Firmware Engineer$122,262
- Software Applications Engineer 4$152,828
- Data Engineer$103,928
- Data Engineer 4$138,528
- Software Applications Engineer 5$149,947
- Business Strategy Manager$125,590
- Software Systems Engineer$125,424
- Research Engineer$142,074
- IT Engineer$126,516
- Software Dev Ops Engineer 3$103,210
- Software Applications Engineer 3$135,446
- Software Applications Engineer 2$110,448
- Software Quality Assurance Engineer$109,075
- Industrial Design Engineer$96,658
- Software Engineer (4)$129,397
- Software Firmware Engineer 3$117,915
- PSS Life Cycle Marketing Professional 3$95,035
- Cloud Engineer 4$158,309
- Machine Learning Engineer 2$137,770
- PSS Life Cycle Marketing Manager$95,534
- Experience Design Engineer$102,326
- Data Scientist$126,392
- Data Engineer 5$131,310
Gaji adalah bahagian bawah gaji yang ditawarkan dalam setiap permohonan, ditukar kepada jumlah tahunan; statistik hanya menggunakan permohonan sepenuh masa yang disahkan. LCA bukan kelulusan visa dan satu LCA boleh merangkumi beberapa jawatan. Sumber: Jabatan Buruh AS, Data Pendedahan LCA OFLC, tahun fiskal 2023–2026 (keputusan terkini 30 Jun 2026).