Laman Utama › Majikan › HP Inc. › Software Firmware Engineer
Software Firmware Engineer di HP Inc.: Gaji H-1B
19 permohonan syarat buruh untuk jawatan Software Firmware Engineer di HP Inc.. Gaji asas median yang ditawarkan $122,262; separuh tengah $103,823–$137,540.
Permohonan (LCA)19
Median gaji yang ditawarkan$122,262
Separuh tengah gaji$103,823–$137,540
Persentil ke-10 hingga ke-90$79,260–$149,718
Mengikut tahun fiskal
| Tahun fiskal | LCA | Gaji median |
|---|---|---|
| FY2023 | 8 | $120,983 |
| FY2024 | 7 | $119,808 |
| FY2026 | 4 | $142,292 |
Permohonan
| Gaji asas | Lokasi | Dihantar | Tarikh mula | Status |
|---|---|---|---|---|
| $149,718–$200,000 Tahap IV | Spring, TX | 20 Mac 2026 | 1 Apr 2026 | Disahkan |
| $149,718–$215,000 Tahap IV | Spring, TX | 16 Mac 2026 | 20 Apr 2026 | Disahkan |
| $105,976–$220,000 Tahap II | Spring, TX | 10 Feb 2026 | 27 Feb 2026 | Disahkan |
| $134,867–$200,000 Tahap III | Fort Collins, CO | 15 Jan 2026 | 15 Apr 2026 | Disahkan |
| $101,670–$150,000 Tahap II | Vancouver, WA | 5 Jun 2024 | 8 Okt 2024 | Disahkan |
| $119,808–$139,808 Tahap III | Spring, TX | 16 Apr 2024 | 1 Okt 2024 | Disahkan |
| $71,531–$123,600 Tahap II | Spring, TX | 27 Mac 2024 | 11 Sep 2024 | Disahkan |
| $80,766–$102,000 Tahap II | Boise, ID | 27 Mac 2024 | 21 Sep 2024 | Disahkan |
| $141,315–$144,690 Tahap IV | Spring, TX | 8 Mac 2024 | 22 Ogo 2024 | Disahkan |
| $171,080–$190,000 Tahap IV | San Diego, CA | 29 Jan 2024 | 1 Feb 2024 | Disahkan |
| $136,552–$144,489 Tahap IV | San Diego, CA | 16 Nov 2023 | 10 Mei 2024 | Disahkan |
| $119,704–$130,000 Tahap III | Fort Collins, CO | 10 Apr 2023 | 15 Apr 2023 | Disahkan |
| $114,982 Tahap IV | Fort Collins, CO | 14 Mac 2023 | 24 Jul 2023 | Disahkan |
| $90,522 Tahap II | Spring, TX | 8 Mac 2023 | 24 Jun 2023 | Disahkan |
| $122,262–$219,345 Tahap IV | San Diego, CA | 28 Feb 2023 | 20 Ogo 2023 | Disahkan |
| $73,237–$90,000 Tahap II | Vancouver, WA | 23 Feb 2023 | 15 Ogo 2023 | Disahkan |
| $129,397 Tahap IV | Spring, TX | 14 Feb 2023 | 3 Jun 2023 | Disahkan |
| $129,397–$150,216 Tahap IV | Spring, TX | 7 Feb 2023 | 31 Jul 2023 | Disahkan |
| $138,528–$159,093 Tahap IV | Vancouver, WA | 13 Jan 2023 | 10 Jul 2023 | Disahkan |
Jawatan lain di HP Inc.
- Software Applications Engineer$121,400
- Electrical/Hardware Engineer$102,024
- Software Applications Engineer 4$152,828
- Data Engineer$103,928
- Data Engineer 4$138,528
- Software Applications Engineer 5$149,947
- Business Strategy Manager$125,590
- Software Systems Engineer$125,424
- Research Engineer$142,074
- IT Engineer$126,516
- Software Dev Ops Engineer 3$103,210
- Software Applications Engineer 3$135,446
- Software Applications Engineer 2$110,448
- Software Quality Assurance Engineer$109,075
- Industrial Design Engineer$96,658
- Software Engineer (4)$129,397
- Software Firmware Engineer 3$117,915
- PSS Life Cycle Marketing Professional 3$95,035
- Cloud Engineer 4$158,309
- Machine Learning Engineer 2$137,770
- PSS Life Cycle Marketing Manager$95,534
- Experience Design Engineer$102,326
- Data Scientist$126,392
- Data Engineer 5$131,310
Gaji adalah bahagian bawah gaji yang ditawarkan dalam setiap permohonan, ditukar kepada jumlah tahunan; statistik hanya menggunakan permohonan sepenuh masa yang disahkan. LCA bukan kelulusan visa dan satu LCA boleh merangkumi beberapa jawatan. Sumber: Jabatan Buruh AS, Data Pendedahan LCA OFLC, tahun fiskal 2023–2026 (keputusan terkini 30 Jun 2026).