H1B Salary Data

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System on Chip Design Engineer at Intel Corporation: H-1B salaries

8 labor condition applications for the job title System on Chip Design Engineer at Intel Corporation. Median offered base salary $182,998; middle half $176,280–$185,307.

Applications (LCAs)8
Median offered salary$182,998
Middle half of salaries$176,280–$185,307
10th–90th percentile$165,304–$188,739

By fiscal year

Fiscal yearLCAsMedian salary
FY20233$169,790
FY20244$184,152
FY20251$196,747

Applications

Base salaryLocationSubmittedStart dateStatus
$196,747–$246,990
Level IV		Hillsboro, ORFeb 20, 2025Aug 19, 2025Certified
$185,307–$259,425
Level III		Folsom, CAMay 13, 2024Oct 1, 2024Certified
$185,307–$209,760
Level III		Folsom, CAMar 23, 2024Sep 8, 2024Certified
$182,998–$238,410
Level IV		Hillsboro, ORMar 22, 2024Aug 25, 2024Certified
$182,998–$238,410
Level IV		Hillsboro, ORMar 22, 2024Aug 23, 2024Certified
$178,443–$221,610
Level IV		Hillsboro, ORMar 10, 2023Sep 4, 2023Certified
$169,790–$209,760
Level III		Folsom, CAMar 10, 2023Sep 2, 2023Certified
$154,835–$221,610
Level III		Hillsboro, ORFeb 23, 2023Aug 16, 2023Certified

Other jobs at Intel Corporation

Salaries are the lower end of the wage offered on each application, converted to a yearly amount; statistics use certified full-time applications only. An LCA is not a visa approval and one LCA can cover several positions. Source: U.S. Department of Labor, OFLC LCA Disclosure Data, fiscal years 2023–2026 (latest decision Jun 30, 2026).