H1B Salary Data

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Principal Semiconductor Design Engineer at Micron Technology, Inc.: H-1B salaries

5 labor condition applications for the job title Principal Semiconductor Design Engineer at Micron Technology, Inc.. Median offered base salary $183,500; middle half $171,850–$194,098.

Applications (LCAs)5
Median offered salary$183,500
Middle half of salaries$171,850–$194,098
10th–90th percentile$166,181–$197,875

By fiscal year

Fiscal yearLCAsMedian salary
FY20242$177,200
FY20251$175,000
FY20261$200,393

Applications

Base salaryLocationSubmittedStart dateStatus
$200,393
Level IV
Boise, IDMay 11, 2026Oct 1, 2026Certified
$204,732
part-time · Level III
Richardson, TXAug 19, 2025Sep 7, 2025Certified
$175,000
Level IV
Atlanta, GAOct 3, 2024Nov 11, 2024Certified
$192,000
Level IV
Folsom, CAJun 14, 2024Jul 8, 2024Certified
$162,401
Level IV
Boise, IDMay 24, 2024Oct 1, 2024Certified

Other jobs at Micron Technology, Inc.

Salaries are the lower end of the wage offered on each application, converted to a yearly amount; statistics use certified full-time applications only. An LCA is not a visa approval and one LCA can cover several positions. Source: U.S. Department of Labor, OFLC LCA Disclosure Data, fiscal years 2023–2026 (latest decision Jun 30, 2026).