H1B Salary Data

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Semiconductor Packaging Engineer at NXP USA, Inc.: H-1B salaries

8 labor condition applications for the job title Semiconductor Packaging Engineer at NXP USA, Inc.. Median offered base salary $137,700; middle half $125,000–$147,897.

Applications (LCAs)8
Median offered salary$137,700
Middle half of salaries$125,000–$147,897
10th–90th percentile$100,040–$152,367

By fiscal year

Fiscal yearLCAsMedian salary
FY20234$120,000
FY20253$151,012
FY20261$145,400

Applications

Base salaryLocationSubmittedStart dateStatus
$145,400
Level II		Austin, TXApr 15, 2026Oct 1, 2026Certified
$146,859
Level IV		Austin, TXMay 21, 2025Oct 1, 2025Certified
$155,530
Level II		Austin, TXMay 2, 2025Oct 1, 2025Certified
$151,012
Level III		Austin, TXNov 15, 2024Dec 2, 2024Certified
$110,000
Level II		Austin, TXAug 4, 2023Oct 1, 2023Certified
$76,800
Level I		Austin, TXMay 17, 2023Oct 1, 2023Certified
$130,000
Level II		Austin, TXApr 17, 2023Oct 1, 2023Certified
$130,000
Level II		Chandler, AZApr 12, 2023Aug 6, 2023Certified

Other jobs at NXP USA, Inc.

Salaries are the lower end of the wage offered on each application, converted to a yearly amount; statistics use certified full-time applications only. An LCA is not a visa approval and one LCA can cover several positions. Source: U.S. Department of Labor, OFLC LCA Disclosure Data, fiscal years 2023–2026 (latest decision Jun 30, 2026).