H1B Salary Data

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Senior Staff Packaging Engineer at Qualcomm Technologies, Inc.: H-1B salaries

12 labor condition applications for the job title Senior Staff Packaging Engineer at Qualcomm Technologies, Inc.. Median offered base salary $169,000; middle half $169,000–$180,400.

Applications (LCAs)12
Median offered salary$169,000
Middle half of salaries$169,000–$180,400
10th–90th percentile$169,000–$180,400

By fiscal year

Fiscal yearLCAsMedian salary
FY20234$169,000
FY20243$169,000
FY20255$180,400

Applications

Base salaryLocationSubmittedStart dateStatus
$180,400–$270,600
Level IV		San Diego, CAMar 25, 2025Jun 1, 2025Certified
$180,400–$270,600
Level IV		San Diego, CAMar 4, 2025Aug 24, 2025Certified
$180,400–$270,600
Level IV		San Diego, CAFeb 17, 2025Aug 11, 2025Certified
$162,400–$243,600
Level IV		Gilbert, AZFeb 4, 2025Jul 26, 2025Certified
$169,000–$254,000
Level IV		San Diego, CANov 22, 2024May 22, 2025Certified
$169,000–$254,000
Level IV		San Diego, CAMay 23, 2024Nov 19, 2024Certified
$169,000–$254,000
Level IV		San Diego, CAFeb 24, 2024Aug 3, 2024Certified
$188,926–$264,500
Level IV		Santa Clara, CASep 25, 2023Mar 22, 2024Certified
$169,000–$254,000
Level IV		San Diego, CAApr 25, 2023Oct 1, 2023Certified
$169,000–$254,000
Level IV		San Diego, CAFeb 20, 2023Jul 13, 2023Certified
$169,000–$254,000
Level IV		San Diego, CAJan 28, 2023Jul 13, 2023Certified
$169,000–$254,000
Level IV		San Diego, CAJan 18, 2023Jul 13, 2023Certified

Other jobs at Qualcomm Technologies, Inc.

Salaries are the lower end of the wage offered on each application, converted to a yearly amount; statistics use certified full-time applications only. An LCA is not a visa approval and one LCA can cover several positions. Source: U.S. Department of Labor, OFLC LCA Disclosure Data, fiscal years 2023–2026 (latest decision Jun 30, 2026).