H1B Salary Data

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Engineer I, Software Analysis Engineering at Samsung Electronics America, Inc.: H-1B salaries

8 labor condition applications for the job title Engineer I, Software Analysis Engineering at Samsung Electronics America, Inc.. Median offered base salary $109,116; middle half $104,500–$117,250.

Applications (LCAs)8
Median offered salary$109,116
Middle half of salaries$104,500–$117,250
10th–90th percentile$97,387–$121,900

By fiscal year

Fiscal yearLCAsMedian salary
FY20234$103,000
FY20242$124,000
FY20262$114,616

Applications

Base salaryLocationSubmittedStart dateStatus
$118,000–$128,000
Level II		Plano, TXApr 29, 2026May 11, 2026Certified
$111,232
Level III		Plano, TXMar 17, 2026Sep 9, 2026Certified
$131,000–$141,000
Level II		Plano, TXJul 18, 2024Aug 1, 2024Certified
$117,000–$127,000
Level II		Plano, TXJul 9, 2024Jul 18, 2024Certified, then withdrawn
$106,000–$116,000
Level II		Plano, TXMay 9, 2023Oct 1, 2023Certified
$100,000–$110,000
Level II		Plano, TXApr 17, 2023Oct 1, 2023Certified
$91,291–$120,000
Level III		Plano, TXApr 11, 2023Oct 1, 2023Certified
$107,000–$140,000
Level II		Plano, TXAug 9, 2021Oct 1, 2021Certified, then withdrawn

Other jobs at Samsung Electronics America, Inc.

Salaries are the lower end of the wage offered on each application, converted to a yearly amount; statistics use certified full-time applications only. An LCA is not a visa approval and one LCA can cover several positions. Source: U.S. Department of Labor, OFLC LCA Disclosure Data, fiscal years 2023–2026 (latest decision Jun 30, 2026).