H1B Salary Data

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Engineer, Firmware at Samsung Semiconductor, Inc.: H-1B salaries

7 labor condition applications for the job title Engineer, Firmware at Samsung Semiconductor, Inc.. Median offered base salary $136,448; middle half $130,686–$141,212.

Applications (LCAs)7
Median offered salary$136,448
Middle half of salaries$130,686–$141,212
10th–90th percentile$125,930–$152,692

By fiscal year

Fiscal yearLCAsMedian salary
FY20232$131,526
FY20251$132,183
FY20263$140,712

Applications

Base salaryLocationSubmittedStart dateStatus
$164,007–$200,000San Jose, CAJun 17, 2026Sep 2, 2026Certified
$164,007–$200,000San Jose, CAJun 16, 2026Sep 2, 2026Denied
$130,187–$200,000
Level II
San Diego, CAJun 12, 2026Oct 16, 2026Certified
$140,712–$185,000San Jose, CAMar 18, 2026May 4, 2026Certified
$132,183–$180,000San Jose, CAApr 10, 2025Oct 1, 2025Certified
$121,673–$154,440San Jose, CAMar 6, 2023Sep 2, 2023Certified
$141,378–$145,000
Level II
San Jose, CAJan 13, 2023Jan 23, 2023Certified

Other jobs at Samsung Semiconductor, Inc.

Salaries are the lower end of the wage offered on each application, converted to a yearly amount; statistics use certified full-time applications only. An LCA is not a visa approval and one LCA can cover several positions. Source: U.S. Department of Labor, OFLC LCA Disclosure Data, fiscal years 2023–2026 (latest decision Jun 30, 2026).