H1B Salary Data

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Principal Engineer, Packaging Engineering at Sandisk Technologies, Inc.: H-1B salaries

10 labor condition applications for the job title Principal Engineer, Packaging Engineering at Sandisk Technologies, Inc.. Median offered base salary $170,248; middle half $170,248–$176,509.

Applications (LCAs)10
Median offered salary$170,248
Middle half of salaries$170,248–$176,509
10th–90th percentile$158,995–$185,869

By fiscal year

Fiscal yearLCAsMedian salary
FY20254$178,058
FY20266$170,248

Applications

Base salaryLocationSubmittedStart dateStatus
$158,995–$178,848
Level III		San Jose, CAMar 27, 2026Sep 26, 2026Certified
$158,995–$178,848
Level III		Milpitas, CAMar 27, 2026Sep 26, 2026Certified
$176,509–$178,848San Jose, CAMar 17, 2026Aug 1, 2026Certified
$176,509–$178,848Milpitas, CAMar 17, 2026Aug 1, 2026Certified
$170,248–$178,848
Level IV		Fremont, CAMar 16, 2026Aug 23, 2026Certified
$170,248–$178,848
Level IV		Milpitas, CAMar 9, 2026Aug 23, 2026Certified
$170,248–$172,800
Level IV		San Jose, CAAug 8, 2025Sep 15, 2025Certified
$170,248–$172,800
Level IV		Milpitas, CAAug 8, 2025Sep 15, 2025Certified
$185,869–$195,700
Level IV		Milpitas, CAJul 17, 2025Aug 4, 2025Certified
$185,869–$195,700
Level IV		Milpitas, CAJul 17, 2025Aug 4, 2025Certified

Other jobs at Sandisk Technologies, Inc.

Salaries are the lower end of the wage offered on each application, converted to a yearly amount; statistics use certified full-time applications only. An LCA is not a visa approval and one LCA can cover several positions. Source: U.S. Department of Labor, OFLC LCA Disclosure Data, fiscal years 2023–2026 (latest decision Jun 30, 2026).