H1B Salary Data

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Software Firmware Engineer 3 at HP Inc.: H-1B salaries

7 labor condition applications for the job title Software Firmware Engineer 3 at HP Inc.. Median offered base salary $117,915; middle half $113,412–$133,588.

Applications (LCAs)7
Median offered salary$117,915
Middle half of salaries$113,412–$133,588
10th–90th percentile$107,253–$145,650

By fiscal year

Fiscal yearLCAsMedian salary
FY20231$155,397
FY20241$117,915
FY20251$112,070
FY20264$121,389

Applications

Base salaryLocationSubmittedStart dateStatus
$128,024–$155,000
Level III
Boise, IDJun 17, 2026Aug 14, 2026Certified
$114,754–$185,000
Level II
Austin, TXMay 26, 2026Oct 1, 2026Certified
$139,152–$185,000
Level III
Austin, TXMar 2, 2026Aug 28, 2026Certified
$100,027–$155,000
Level II
Boise, IDFeb 20, 2026Aug 14, 2026Certified
$112,070–$142,384
Level II
Vancouver, WAJan 9, 2025Jun 16, 2025Certified
$117,915–$137,915
Level IV
Fort Collins, COApr 11, 2024Oct 1, 2024Certified
$155,397
Level IV
San Diego, CAMar 31, 2023Sep 10, 2023Certified

Other jobs at HP Inc.

Salaries are the lower end of the wage offered on each application, converted to a yearly amount; statistics use certified full-time applications only. An LCA is not a visa approval and one LCA can cover several positions. Source: U.S. Department of Labor, OFLC LCA Disclosure Data, fiscal years 2023–2026 (latest decision Jun 30, 2026).