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ID州Boise市的Electrical Engineers职位：H-1B薪资
工作地点位于ID州Boise市的该职业共有244份劳工条件申请。提供的基本薪资中位数为$120,501；中间50%区间为$106,186至$141,965。
申请（LCAs）244
薪资中位数$120,501
薪资中间区间$106,186–$141,965
第10至第90百分位$96,000–$165,000
按薪资等级
| 工资等级 | 薪资中位数 |
|---|---|
| I级（入门） | $95,000 |
| II级（合格） | $115,360 |
| III级（有经验） | $129,980 |
| IV级（完全胜任） | $160,000 |
劳工部为每个职业和地区设定了四个现行工资等级，从一级（入门）到四级（完全胜任）。雇主根据职位要求选择合适的等级。
雇主
| 雇主 | LCA数量 | 薪资中位数 |
|---|---|---|
| Micron Technology, Inc. | 225 | $120,658 |
| Micron Idaho Semiconductor Manufacturing (Triton) LLC | 5 | $130,000 |
| Schweitzer Engineering Laboratories, Inc. | 4 | $127,000 |
| Engineering Consultants, Inc | 2 | $87,720 |
| SEL Engineering Services, Inc. | 2 | $107,584 |
| Applied Materials, Inc | 1 | $123,249 |
| KLA Corporation | 1 | $133,715 |
| Jacobs Engineering Group Inc. | 1 | $102,491 |
| Dick Campbell Company | 1 | $87,672 |
| HP Inc. | 1 | $154,190 |
| Thermo Fisher Scientific Inc. | 1 | $100,000 |
职位名称
- Semiconductor Design Engineer17
- Semiconductor Process Engineer7
- Semiconductor Product Engineer6
- Product Development Engineer6
- Senior Semiconductor Process Engineer6
- Sr. Engineer - NAND PI4
- DRAM Design Engineer3
- NAND PI Engineer3
- Applications Engineer3
- Scribe Design Engineer3
- Sr. Hardware Development Engineer3
- Senior Semiconductor Design Engineer3
- Sr Engineer, Scribe Design3
- Design Engineer2
- Product Engineer2
薪资为每份申请中提供的工资下限，已转换为年度金额；统计数据仅使用已认证的全职申请。LCA 并非签证批准，一份 LCA 可涵盖多个职位。 来源：美国劳工部 OFLC LCA 披露数据，财年 2023–2026（最新决定日期 2026年6月30日）。