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ID州Boise市的Electronics Engineers, Except Computer职位:H-1B薪资
工作地点位于ID州Boise市的该职业共有144份劳工条件申请。提供的基本薪资中位数为$112,828;中间50%区间为$102,062至$130,499。
申请(LCAs)144
薪资中位数$112,828
薪资中间区间$102,062–$130,499
第10至第90百分位$94,464–$152,051
按薪资等级
| 工资等级 | 薪资中位数 |
|---|---|
| I级(入门) | $104,312 |
| II级(合格) | $101,766 |
| III级(有经验) | $115,000 |
| IV级(完全胜任) | $140,000 |
劳工部为每个职业和地区设定了四个现行工资等级,从一级(入门)到四级(完全胜任)。雇主根据职位要求选择合适的等级。
雇主
| 雇主 | LCA数量 | 薪资中位数 |
|---|---|---|
| Micron Technology, Inc. | 122 | $115,000 |
| Micron Idaho Semiconductor Manufacturing (Triton) LLC | 7 | $104,312 |
| KLA Corporation | 5 | $103,000 |
| Marvell Semiconductor, Inc. | 4 | $100,500 |
| Applied Materials, Inc | 3 | $100,000 |
| Micron Semiconductor Products, Inc. | 2 | $141,600 |
| Intel NDTM US LLC | 1 | $130,998 |
职位名称
- Semiconductor Design Engineer8
- Product Development Engineer8
- Semiconductor Product Engineer5
- Customer Engagement Applications Engineer5
- DRAM Design Engineer4
- Semiconductor Process Engineer4
- R&D Metrology Process Development Engineer3
- Eng-Deg Technology Node Dev De3
- Principal Engineer, NAND PI2
- Senior Engineer – CVD/DF Films – DRAM2
- Architecture Modeling Engineer2
- Process Support Engineer2
- Semiconductor Product Engineer 22
- DRAM Product Engineer2
- Semiconductor Product Engineer 32
薪资为每份申请中提供的工资下限,已转换为年度金额;统计数据仅使用已认证的全职申请。LCA 并非签证批准,一份 LCA 可涵盖多个职位。 来源:美国劳工部 OFLC LCA 披露数据,财年 2023–2026(最新决定日期 2026年6月30日)。