H1B Salary Data

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Principal Engineer Software at Dish Wireless LLC: H-1B salaries

8 labor condition applications for the job title Principal Engineer Software at Dish Wireless LLC. Median offered base salary $159,494; middle half $155,766–$164,112.

Applications (LCAs)8
Median offered salary$159,494
Middle half of salaries$155,766–$164,112
10th–90th percentile$142,547–$164,112

By fiscal year

Fiscal yearLCAsMedian salary
FY20231$120,328
FY20241$152,069
FY20266$163,051

Applications

Base salaryLocationSubmittedStart dateStatus
$164,112–$235,950
Level IV
Denver, COMay 13, 2026Oct 1, 2026Certified
$164,112–$235,950
Level IV
Denver, COApr 27, 2026Oct 23, 2026Certified
$164,112–$235,950
Level IV
Denver, COApr 20, 2026Oct 1, 2026Certified
$156,998–$235,950
Level IV
Plano, TXApr 7, 2026Oct 2, 2026Certified
$156,998–$235,950
Level IV
Plano, TXJan 22, 2026Jul 24, 2026Certified
$161,990–$235,950
Level IV
Englewood, COJan 14, 2026Jan 26, 2026Certified
$152,069–$214,500
Level IV
Denver, COOct 6, 2023Oct 23, 2023Certified
$120,328–$214,500
Level III
Plano, TXSep 22, 2023Oct 2, 2023Certified

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Salaries are the lower end of the wage offered on each application, converted to a yearly amount; statistics use certified full-time applications only. An LCA is not a visa approval and one LCA can cover several positions. Source: U.S. Department of Labor, OFLC LCA Disclosure Data, fiscal years 2023–2026 (latest decision Jun 30, 2026).