H1B Salary Data

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Engineer I - Wireless at Dish Wireless LLC: H-1B salaries

8 labor condition applications for the job title Engineer I - Wireless at Dish Wireless LLC. Median offered base salary $81,796; middle half $73,886–$91,816.

Applications (LCAs)8
Median offered salary$81,796
Middle half of salaries$73,886–$91,816
10th–90th percentile$71,334–$94,578

By fiscal year

Fiscal yearLCAsMedian salary
FY20231$74,381
FY20253$94,578
FY20264$79,682

Applications

Base salaryLocationSubmittedStart dateStatus
$72,400–$134,400
Level I		Plano, TXMay 5, 2026Oct 1, 2026Certified
$86,965–$134,400
Level II		Plano, TXApr 17, 2026May 4, 2026Certified
$68,848–$134,400
Level I		Plano, TXApr 17, 2026May 4, 2026Certified
$90,896–$134,400
Level I		Plano, TXApr 9, 2026May 4, 2026Certified
$94,578–$134,400
Level I		Littleton, COMay 30, 2025Jun 15, 2025Certified
$94,578–$154,450
Level I		Littleton, COApr 29, 2025Oct 1, 2025Certified
$76,627–$134,400
Level I		Littleton, COApr 21, 2025May 10, 2025Certified
$74,381–$122,200
Level II		Plano, TXApr 14, 2023Oct 1, 2023Certified

Other jobs at Dish Wireless LLC

Salaries are the lower end of the wage offered on each application, converted to a yearly amount; statistics use certified full-time applications only. An LCA is not a visa approval and one LCA can cover several positions. Source: U.S. Department of Labor, OFLC LCA Disclosure Data, fiscal years 2023–2026 (latest decision Jun 30, 2026).