Home › Occupations › Materials Engineers › Boise, ID
Materials Engineers in Boise, ID: H-1B salaries
222 labor condition applications for this occupation with a work site in Boise, ID. Median offered base salary $117,473; middle half $101,988–$131,718.
Applications (LCAs)222
Median offered salary$117,473
Middle half of salaries$101,988–$131,718
10th–90th percentile$92,700–$147,000
By wage level
| Wage level | Median salary |
|---|---|
| Level I (entry) | $94,998 |
| Level II (qualified) | $104,987 |
| Level III (experienced) | $120,000 |
| Level IV (fully competent) | $135,804 |
The Department of Labor sets four prevailing wage levels for each occupation and area, from Level I (entry) to Level IV (fully competent). The employer picks the level that matches the job's requirements.
Employers
| Employer | LCAs | Median salary |
|---|---|---|
| Micron Technology, Inc. | 162 | $119,995 |
| Micron Idaho Semiconductor Manufacturing (Triton) LLC | 29 | $110,000 |
| Applied Materials, Inc | 8 | $108,218 |
| Lam Research Corporation | 6 | $103,990 |
| Asm America Inc. | 5 | $93,100 |
| Tokyo Electron America, Inc. | 4 | $119,088 |
| KLA Corporation | 4 | $98,887 |
| Nova Measuring Instruments Inc. | 3 | $86,445 |
| Asml US, LP | 1 | $87,550 |
Job titles
- Semiconductor Process Engineer37
- Process Support Engineer8
- Field Process Engineer6
- Engineer - Cvd/diff Dram4
- Senior Semiconductor Process Engineer4
- Process Development Engineer4
- R&D Dry Etch Process Development Engineer3
- CMP Senior Process Engineer3
- Product Development Engineer3
- Snr Field Process Engineer I3
- Sr Engineer, Photo DRAM3
- Application Scientist2
- R&D Photolithography Process Development Engineer2
- Engineer-Dry Etch-DRAM/EM2
- Field Applications Engineer2
Salaries are the lower end of the wage offered on each application, converted to a yearly amount; statistics use certified full-time applications only. An LCA is not a visa approval and one LCA can cover several positions. Source: U.S. Department of Labor, OFLC LCA Disclosure Data, fiscal years 2023–2026 (latest decision Jun 30, 2026).