H1B Salary Data

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Firmware Engineer II at Milwaukee Electric Tool Corporation: H-1B salaries

9 labor condition applications for the job title Firmware Engineer II at Milwaukee Electric Tool Corporation. Median offered base salary $104,000; middle half $96,305–$108,150.

Applications (LCAs)9
Median offered salary$104,000
Middle half of salaries$96,305–$108,150
10th–90th percentile$95,520–$120,037

By fiscal year

Fiscal yearLCAsMedian salary
FY20243$108,150
FY20252$94,952
FY20264$110,666

Applications

Base salaryLocationSubmittedStart dateStatus
$103,500
Level II
Brookfield, WIJun 19, 2026Dec 15, 2026Certified
$128,856
Level II
Chicago, ILApr 1, 2026Oct 1, 2026Certified
$117,832
Level II
Brookfield, WIJan 23, 2026May 25, 2026Certified
$96,000
Level II
Brookfield, WIJan 20, 2026Jul 8, 2026Certified
$96,305
Level II
Brookfield, WIApr 1, 2025Oct 1, 2025Certified
$93,600
Level II
Brookfield, WIJan 7, 2025Jan 20, 2025Certified
$108,150
Level II
Chicago, ILJun 24, 2024Jul 1, 2024Certified
$108,150
Level II
Chicago, ILJun 5, 2024Jul 1, 2024Certified, then withdrawn
$104,000
Level II
Brookfield, WIApr 26, 2024Oct 1, 2024Certified

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Salaries are the lower end of the wage offered on each application, converted to a yearly amount; statistics use certified full-time applications only. An LCA is not a visa approval and one LCA can cover several positions. Source: U.S. Department of Labor, OFLC LCA Disclosure Data, fiscal years 2023–2026 (latest decision Jun 30, 2026).